Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

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  1. CHANDRA
    CHANDRA
    COM Express® Compact Type 6 with Intel® Atom™ E3800 and Celeron® (formerly Bay Trail) Processors
  2. ECHO
    ECHO
    COM Express® Basic Type 6 Module with Intel® Haswell Processors
  3. ORION
    ORION
    COM-HPC® Client module Size A with 12th Gen Intel® Core™ (formerly Alder Lake - P series) Processors
  4. LAGOON
    LAGOON
    COM-HPC® Client module Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications
  5. CARINA
    CARINA
    COM-HPC® Client module Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors
  6. ETX-A61
    ETX-A61
    ETX® Module with the Intel® Atom™ E3800 and Celeron® families (Bay Trail) System-on-Chip

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