Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

6 Items

per page
Set Descending Direction
  1. OPHELIA
    OPHELIA
    COM Express® 3.0 Type 6 Compact Module with AMD Ryzen™ Embedded V2000 SoCs
  2. METIS
    METIS
    COM Express® Rel. 3.0 Compact Type 6 module with AMD Ryzen™ Embedded R1000 family of SoCs
  3. THEBE
    THEBE
    COM Express® Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCs
  4. MIRANDA
    MIRANDA
    COM Express® Rel. 3.0 Compact Type 6 module with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  5. OBERON
    OBERON
    COM Express® Rel. 3.0 Basic Type 6 module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) Processors
  6. CHARON
    CHARON
    COM Express® Rel. 3.0 Compact Type 6 module with AMD Ryzen™ Embedded V1000 Processors

6 Items

per page
Set Descending Direction