Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

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  1. CALYPSO
    CALYPSO
    COM Express® Rel. 3.0 Compact Type 6 Module with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
  2. MAIA
    MAIA
    Qseven® Rel. 2.1 module with NXP i.MX 8 Applications Processors
  3. NAOS
    NAOS
    Qseven® Rel. 2.1 module with Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  4. KUMA
    KUMA
    μQseven Rel. 2.0 module with Intel® Atom™ E3800 and Celeron® (formerly Bay Trail) Processors
  5. ASTERION
    ASTERION
    Qseven® Rel. 2.0 module with Intel® Atom™ E3800 and Celeron® (formerly Bay Trail) Processors
  6. AVIOR
    AVIOR
    Qseven® Rel. 2.0 Compliant Module with Intel® Atom™ E3800 and Celeron® (formerly Bay Trail) Processors
  7. FELIS
    FELIS
    Qseven® Rel. 1.20 Compliant Module with Intel® Atom™ E6xxT series CPU + EG20T Chipset
  8. DELTA
    DELTA
    Qseven® module with NVIDIA® Tegra® T30 Processor
  9. ALYA
    ALYA
    Qseven® module with Intel® Atom™ E6xx series CPU+ EG20T Chipset
  10. HALLEY
    HALLEY
    SMARC® Rel. 2.1.1 module with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) Processors for FuSa applications

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