Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

5 Items

per page
Set Descending Direction
  1. Trizeps VIII Plus
    Trizeps VIII Plus
    SODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
  2. Trizeps VIII
    Trizeps VIII
    SODIMM-200 CPU-Module with NXP i.MX 8M Applications Processors
  3. Trizeps VIII Mini
    Trizeps VIII Mini
    SODIMM-200 CPU-Module with NXP i.MX 8M Mini Applications Processors
  4. TARVOS
    TARVOS
    COM Express® Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs
  5. AMOS
    AMOS
    COM Express® Compact Type 6 with AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon)

5 Items

per page
Set Descending Direction