Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

Items 1-10 of 17

Page
per page
Set Descending Direction
  1. Trizeps VIII Plus
    Trizeps VIII Plus
    SODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
  2. Trizeps VIII
    Trizeps VIII
    SODIMM-200 CPU-Module with NXP i.MX 8M Applications Processors
  3. ARCALIS
    ARCALIS
    Qseven® Rel. 2.1 module with NXP i.MX 8X Applications Processors
  4. NAOS
    NAOS
    Qseven® Rel. 2.1 module with Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  5. LEVY
    LEVY
    SMARC® Rel. 2.1.1 module with NXP i.MX 8M Plus Applications Processors
  6. SWAN
    SWAN
    SMARC® Rel. 2.1.1 module with NXP i.MX 8X Applications Processors
  7. LEXELL
    LEXELL
    SMARC® Rel. 2.1.1 module with NXP i.MX 8M Applications Processors
  8. RUSSELL
    RUSSELL
    SMARC® Rel. 2.0 module with Xilinx® Zynq® Ultrascale+™ MPSoC
  9. JAGER
    JAGER
    SMARC® Rel. 2.1 module with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  10. METIS
    METIS
    COM Express® Rel. 3.0 Compact Type 6 module with AMD Ryzen™ Embedded R1000 family of SoCs

Items 1-10 of 17

Page
per page
Set Descending Direction