Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

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  1. Myon I
    Myon I
    Micro CPU module with Snapdragon™ 410E
  2. Trizeps VII SX
    Trizeps VII SX
    SODIMM-200 CPU-Module with NXP i.MX 6SoloX Application Processor
  3.  Trizeps VII
    Trizeps VII
    SODIMM-200 CPU-Module with NXP i.MX6 Applications Processors
  4. Myon II
    Myon II
    Micro CPU module with NXP i.MX 8M Mini & i.MX8M Nano Applications Processors
  5. Trizeps VIII Plus
    Trizeps VIII Plus
    SODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
  6. Trizeps VIII
    Trizeps VIII
    SODIMM-200 CPU-Module with NXP i.MX 8M Applications Processors
  7. Trizeps VIII Mini
    Trizeps VIII Mini
    SODIMM-200 CPU-Module with NXP i.MX 8M Mini Applications Processors
  8. CALYPSO
    CALYPSO
    COM Express® Rel. 3.0 Compact Type 6 Module with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
  9. ATLAS
    ATLAS
    Qseven® Rel. 2.1 compliant module with Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (formerly Elkhart Lake)
  10. ELECTRA
    ELECTRA
    μQseven® module with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors

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