Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

6 Items

per page
Set Descending Direction
  1. LARISSA
    LARISSA
    COM Express® Rel. 3.0 Compact Type 6 module with 8th Gen Intel® Core™ and Celeron™ U-series (formerly Whiskey Lake-U) Processors
  2. MIRANDA
    MIRANDA
    COM Express® Rel. 3.0 Compact Type 6 module with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  3. OBERON
    OBERON
    COM Express® Rel. 3.0 Basic Type 6 module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) Processors
  4. TARVOS
    TARVOS
    COM Express® Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs
  5. AMOS
    AMOS
    COM Express® Compact Type 6 with AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon)
  6. ETX-A61
    ETX-A61
    ETX® Module with the Intel® Atom™ E3800 and Celeron® families (Bay Trail) System-on-Chip

6 Items

per page
Set Descending Direction