Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

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  1. CALYPSO
    CALYPSO
    COM Express® Rel. 3.0 Compact Type 6 Module with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
  2. ATLAS
    ATLAS
    Qseven® Rel. 2.1 compliant module with Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (formerly Elkhart Lake)
  3. NAOS
    NAOS
    Qseven® Rel. 2.1 module with Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  4. DELTA
    DELTA
    Qseven® module with NVIDIA® Tegra® T30 Processor
  5. HALLEY
    HALLEY
    SMARC® Rel. 2.1.1 module with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) Processors for FuSa applications
  6. RUSSELL
    RUSSELL
    SMARC® Rel. 2.0 module with Xilinx® Zynq® Ultrascale+™ MPSoC
  7. JAGER
    JAGER
    SMARC® Rel. 2.1 module with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  8. METIS
    METIS
    COM Express® Rel. 3.0 Compact Type 6 module with AMD Ryzen™ Embedded R1000 family of SoCs
  9. LARISSA
    LARISSA
    COM Express® Rel. 3.0 Compact Type 6 module with 8th Gen Intel® Core™ and Celeron™ U-series (formerly Whiskey Lake-U) Processors
  10. THEBE
    THEBE
    COM Express® Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCs

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