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Items 1-10 of 65

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  1. OPHELIA
    OPHELIA
    COM Express® 3.0 Type 6 Compact Module with AMD Ryzen™ Embedded V2000 SoCs
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  2. Trizeps VIII Plus (by Keith & Koep)
    Trizeps VIII Plus (by Keith & Koep)
    SODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
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  3. PICTOR
    PICTOR
    Boxed solution based on Rockchip RK3399 Applications Processor
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  4. ELECTRA (formerly codenamed μQ7-C72)
    ELECTRA (formerly codenamed μQ7-C72)
    μQseven® module with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors
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  5. ARCALIS (formerly codenamed Q7-C58)
    ARCALIS (formerly codenamed Q7-C58)
    Qseven® Rel. 2.1 module with NXP i.MX 8X Applications Processors
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  6. MAIA (formerly codenamed Q7-C26)
    MAIA (formerly codenamed Q7-C26)
    Qseven® Rel. 2.1 module with NXP i.MX 8 Applications Processors
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  7. MIRA (formerly codenamed Q7-C25)
    MIRA (formerly codenamed Q7-C25)
    Qseven® Rel. 2.1 module with NXP i.MX 8M Applications Processors
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  8. NEMBUS (formerly codenamed μQ7-A75-J)
    NEMBUS (formerly codenamed μQ7-A75-J)
    μQseven® module with NXP i.MX 6 Processors
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  9. LIBERTAS (formerly codenamed μQ7-962)
    LIBERTAS (formerly codenamed μQ7-962)
    μQseven® module with NXP i.MX 6 Processor
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  10. ALKES (formerly codenamed Q7-928)
    ALKES (formerly codenamed Q7-928)
    Qseven® module with NXP i.MX 6 Processor
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Items 1-10 of 65

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Cpu Power Consumption
  1. range 10-25 W 2 item
  2. range < 10 W 21 item
  3. range < 5 W 6 item
  4. range > 25 W 1 item
Cpu Type
  1. AMD® Ryzen™ embedded V-Series™ 1 item
  2. NVIDIA Tegra® T30  1 item
  3. NXP i.MX 8M 5 item
  4. NXP i.MX 8M Mini 7 item
  5. NXP i.MX 8M Nano 3 item
  6. NXP i.MX 8M Plus 2 item
  7. NXP i.MX 8X 3 item
  8. NXP i.MX6  35 item
  9. NXP i.MX8  3 item
  10. Rockchip PX30 1 item
  11. Rockchip RK3399 4 item
  12. Texas Instruments® OMAP™ 37xx  1 item
  13. Xilinx® Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 61 item
  2. ETHERNET≥2 21 item
Form Factor
  1. Boxed Solutions 3 item
  2. COM Express® 1 item
  3. Modular HMIs 23 item
  4. Qseven 9 item
  5. Single Board Computer  17 item
  6. SMARC 4 item
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 3 item
  2. 48,5 x 32,5 mm 1 item
  3. 67,6 x 36,7 mm 5 item
  4. ≤ 100 x 100mm 16 item
  5. ≤ 80 x 80mm 14 item
  6. ≥ 100 x 100mm 32 item
Form Factor Specification
  1. 3,5" 6 item
  2. COM Express Compact 1 item
  3. Other Single Board Computers 8 item
  4. Qseven 70x70 mm 6 item
  5. µQseven 70x40 3 item
Mass Storage
  1. microSD card slot  18 item
  2. mSATA half-size slot 1 item
  3. onboard eMMC 62 item
  4. onboard SSD 1 item
  5. SATA channels ≥ 1 8 item
  6. SATA channels ≥ 2  2 item
  7. SD interface  32 item
  8. standard SATA connector 1 item
Memory
  1. soldered down 28 item
  2. SO_DIMM 1 item
  3. ≤1 59 item
  4. ≤2 30 item
  5. ≤4 22 item
  6. ≤8 7 item
  7. ≥32 1 item
Operating Temperature
  1. -20°C ÷ +60°C 20 item
  2. -40°C ÷ +85°C 26 item
  3. 0°C ÷ +50°C 51 item
  4. 0°C ÷ +60°C 52 item
  5. 20°C ÷ +70°C 19 item
Pci Express
  1. PCI-e lanes ≥ 1 16 item
  2. PCI-e lanes ≥ 2 5 item
  3. PCI-e lanes ≥ 3 2 item
  4. PCI-e lanes ≥ 4 2 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. ≥1 25 item
  2. ≥2 18 item
  3. ≥3 14 item
USB
  1. USB 2.0 ≥ 1  60 item
  2. USB 2.0 ≥ 2  54 item
  3. USB 2.0 ≥ 3 26 item
  4. USB 2.0 ≥ 4 12 item
  5. USB 2.0 ≥ 5 6 item
  6. USB 2.0 ≥ 6 2 item
  7. USB 3.0 ≥ 1 17 item
  8. USB 3.0 ≥ 2 11 item
  9. USB 3.0 ≥ 4 1 item
  10. USB CLIENT 2 item
  11. USB OTG 46 item
Video Interfaces
  1. DDI 1 item
  2. DP 7 item
  3. DUAL CHANNEL LVDS 26 item
  4. eDP 9 item
  5. HDMI 32 item
  6. MIPI-CSI camera connector 5 item
  7. MIPI-DSI 7 item
  8. PARALLEL RGB 5 item
  9. SINGLE CHANNEL LVDS 31 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 4 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 3 item
  3. M.2 Socket 2 key B (SSD) 1 item
  4. ONBOARD WI-FI/BLE 23 item