Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

5 Items

per page
Set Descending Direction
  1. JULIET
    JULIET
    COM Express® Rel.3.0 Basic Type 7 module, with the Intel® Xeon® D-1700 processors (formerly Ice Lake- D)
  2. THEBE
    THEBE
    COM Express® Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCs
  3. OBERON
    OBERON
    COM Express® Rel. 3.0 Basic Type 6 module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) Processors
  4. TARVOS
    TARVOS
    COM Express® Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs
  5. ECHO
    ECHO
    COM Express® Basic Type 6 Module with Intel® Haswell Processors

5 Items

per page
Set Descending Direction