Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

10 Items

per page
Set Descending Direction
  1. Myon I
    Myon I
    Micro CPU module with Snapdragon™ 410E
  2. Myon II
    Myon II
    Micro CPU module with NXP i.MX 8M Mini & i.MX8M Nano Applications Processors
  3. Trizeps VIII Plus
    Trizeps VIII Plus
    SODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
  4. Trizeps VIII
    Trizeps VIII
    SODIMM-200 CPU-Module with NXP i.MX 8M Applications Processors
  5. Trizeps VIII Mini
    Trizeps VIII Mini
    SODIMM-200 CPU-Module with NXP i.MX 8M Mini Applications Processors
  6. ARCALIS
    ARCALIS
    Qseven® Rel. 2.1 module with NXP i.MX 8X Applications Processors
  7. SWAN
    SWAN
    SMARC® Rel. 2.1.1 module with NXP i.MX 8X Applications Processors
  8. LEXELL
    LEXELL
    SMARC® Rel. 2.1.1 module with NXP i.MX 8M Applications Processors
  9. JAGER
    JAGER
    SMARC® Rel. 2.1 module with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  10. CARINA
    CARINA
    COM-HPC® Client module Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors

10 Items

per page
Set Descending Direction