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Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

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  1. Myon I
    Myon I
    Micro CPU module with Snapdragon™ 410E
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  2. Trizeps VII SX
    Trizeps VII SX
    SODIMM-200 CPU-Module with NXP i.MX 6SoloX Application Processor
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  3. Trizeps VII
    Trizeps VII
    SODIMM-200 CPU-Module with NXP i.MX6 Applications Processors
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  4. Myon II
    Myon II
    Micro CPU module with NXP i.MX 8M Mini & i.MX8M Nano Applications Processors
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  5. Trizeps VIII Plus
    Trizeps VIII Plus
    SODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
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  6. Trizeps VIII
    Trizeps VIII
    SODIMM-200 CPU-Module with NXP i.MX 8M Applications Processors
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  7. Trizeps VIII Mini
    Trizeps VIII Mini
    SODIMM-200 CPU-Module with NXP i.MX 8M Mini Applications Processors
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  8. CALYPSO
    CALYPSO
    COM Express® Rel. 3.0 Compact Type 6 Module with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
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  9. ATLAS
    ATLAS
    Qseven® Rel. 2.1 compliant module with Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (formerly Elkhart Lake)
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  10. ELECTRA
    ELECTRA
    μQseven® module with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors
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Cpu Power Consumption
  1. range 10-25 W 17 item
  2. range < 10 W 22 item
  3. range < 5 W 7 item
  4. range > 25 W 4 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD® G-Series™ 1 item
  3. AMD® R-Series  1 item
  4. AMD® Ryzen™ embedded V-Series™ 1 item
  5. Intel® Atom™ 12 item
  6. Intel® Celeron® 12 item
  7. Intel® Core™  5 item
  8. Intel® Pentium®  6 item
  9. Intel® Xeon® 1 item
  10. NVIDIA Tegra® T30  1 item
  11. NXP i.MX 8M 3 item
  12. NXP i.MX 8M Mini 3 item
  13. NXP i.MX 8M Nano 2 item
  14. NXP i.MX 8M Plus 2 item
  15. NXP i.MX 8X 1 item
  16. NXP i.MX6  4 item
  17. NXP i.MX8  1 item
  18. Qualcomm Snapdragon 1 item
  19. Xilinx® Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 34 item
  2. ETHERNET≥2 8 item
Form Factor
  1. COM Express® 10 item
  2. COM-HPC® 1 item
  3. ETX®  1 item
  4. Qseven 13 item
  5. SMARC 6 item
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 3 item
  2. 48,5 x 32,5 mm 2 item
  3. 67,6 x 36,7 mm 5 item
  4. ≤ 100 x 100mm 24 item
  5. ≤ 80 x 80mm 19 item
  6. ≥ 100 x 100mm 5 item
Form Factor Specification
  1. COM Express Basic 4 item
  2. COM Express Compact 6 item
  3. COM-HPC Client 1 item
  4. Qseven 70x70 mm 10 item
  5. µQseven 70x40 3 item
Mass Storage
  1. CFAST slot 2 item
  2. M.2 NVMe SSD slot 1 item
  3. microSD card slot  6 item
  4. onboard eMMC 29 item
  5. onboard SSD 2 item
  6. PATA channel 2 item
  7. SATA channels ≥ 1 24 item
  8. SATA channels ≥ 2  18 item
  9. SATA channels ≥ 3 4 item
  10. SATA channels ≥ 4 2 item
  11. SD interface  19 item
Operating Temperature
  1. -20°C ÷ +60°C 20 item
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 28 item
  4. 0°C ÷ +50°C 26 item
  5. 0°C ÷ +60°C 29 item
  6. 20°C ÷ +70°C 20 item
Pci Express
  1. PCI-e lanes ≥ 1 31 item
  2. PCI-e lanes ≥ 2 23 item
  3. PCI-e lanes ≥ 3 19 item
  4. PCI-e lanes ≥ 4 17 item
  5. PCI-e lanes ≥ 5 9 item
Ttl Uarts
  1. ≥1 31 item
  2. ≥2 25 item
  3. ≥3 10 item
USB
  1. USB 2.0 ≥ 1  33 item
  2. USB 2.0 ≥ 2  31 item
  3. USB 2.0 ≥ 3 27 item
  4. USB 2.0 ≥ 4 25 item
  5. USB 2.0 ≥ 5 19 item
  6. USB 2.0 ≥ 6 17 item
  7. USB 3.0 ≥ 1 20 item
  8. USB 3.0 ≥ 2 15 item
  9. USB 3.0 ≥ 3 7 item
  10. USB 3.0 ≥ 4 5 item
  11. USB 3.1 ≥ 1 5 item
  12. USB 3.1 ≥ 2 5 item
  13. USB 3.2 ≥ 2 1 item
  14. USB 4.0 ≥ 1 1 item
  15. USB 4.0 ≥ 2 1 item
  16. USB 4.0 ≥ 3 1 item
  17. USB 4.0 ≥ 4 1 item
  18. USB CLIENT 4 item
  19. USB OTG 13 item
Video Interfaces
  1. DDI 7 item
  2. DP 11 item
  3. DP++ 8 item
  4. DUAL CHANNEL LVDS 25 item
  5. eDP 18 item
  6. HDMI 22 item
  7. MIPI-CSI camera connector 4 item
  8. MIPI-DSI 8 item
  9. PARALLEL RGB 5 item
  10. SDVO 2 item
  11. SINGLE CHANNEL LVDS 30 item
  12. VGA 6 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 1 item
  2. ONBOARD WI-FI/BLE 5 item