Modules
Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description
The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.
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Myon IMicro CPU module with Snapdragon™ 410E
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Trizeps VII SXSODIMM-200 CPU-Module with NXP i.MX 6SoloX Application Processor
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Trizeps VIISODIMM-200 CPU-Module with NXP i.MX6 Applications Processors
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Myon IIMicro CPU module with NXP i.MX 8M Mini & i.MX8M Nano Applications Processors
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Trizeps VIII PlusSODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
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Trizeps VIIISODIMM-200 CPU-Module with NXP i.MX 8M Applications Processors
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Trizeps VIII MiniSODIMM-200 CPU-Module with NXP i.MX 8M Mini Applications Processors
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ATLASQseven® Rel. 2.1 compliant module with Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (formerly Elkhart Lake)
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ELECTRAμQseven® module with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors
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MAIAQseven® Rel. 2.1 module with NXP i.MX 8 Applications Processors