COM Express®

COM Express®

For high-end design and markets
High graphic processing capabilities
Rich functionality
For high-performance projects
2 formats: Basic (4.92 x 3.74 in) and Compact (3. 74 x 3.74 in)
Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The COM Express® standard lets you customize your projects quickly and cost-effectively. SECO modules are available in COM Express® Type 6 and Type 7, in two formats: “Basic”, with dimensions of 4.92 x 3.74 in, suited to highly energy-sensitive devices, and “Compact”, 3.74 x 3.74 in, a good compromise between high performance and reduced size.

COM Express® Interfaces

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  1. CALYPSO
    CALYPSO
    COM Express® Rel. 3.0 Compact Type 6 Module with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
  2. JULIET
    JULIET
    COM Express® Rel.3.0 Basic Type 7 module, with the Intel® Xeon® D-1700 processors (formerly Ice Lake- D)
  3. OPHELIA
    OPHELIA
    COM Express® 3.0 Type 6 Compact Module with AMD Ryzen™ Embedded V2000 SoCs
  4. METIS
    METIS
    COM Express® Rel. 3.0 Compact Type 6 module with AMD Ryzen™ Embedded R1000 family of SoCs
  5. LARISSA
    LARISSA
    COM Express® Rel. 3.0 Compact Type 6 module with 8th Gen Intel® Core™ and Celeron™ U-series (formerly Whiskey Lake-U) Processors
  6. THEBE
    THEBE
    COM Express® Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCs
  7. MIRANDA
    MIRANDA
    COM Express® Rel. 3.0 Compact Type 6 module with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
  8. OBERON
    OBERON
    COM Express® Rel. 3.0 Basic Type 6 module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) Processors
  9. CHARON
    CHARON
    COM Express® Rel. 3.0 Compact Type 6 module with AMD Ryzen™ Embedded V1000 Processors
  10. TARVOS
    TARVOS
    COM Express® Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs

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