Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

As the world becomes increasingly reliant on intelligent and interconnected devices, the demand for efficient and customizable embedded systems continues to rise. If you're in the midst of researching the ideal hardware solution for your project, you may have come across the term "Computer on Module" or "COM."

What is a Computer on Module?

A Computer on Module, also known as a System on Module (SOM), is a compact, integrated electronic module that encapsulates the core computing components of a system. It typically consists of a processor, memory, storage, and various peripheral interfaces, all within a small form factor. COMs are designed to be easily integrated into custom carrier boards, providing developers with a modular approach to building embedded systems.

Which are the advantages of Computer on Modules?

  • Scalability and Flexibility: Off-the-shelf SOMs offer a high level of scalability and flexibility. By separating the core computing module from the carrier board, developers can easily upgrade or replace the COM without redesigning the entire system. This modular approach allows for rapid prototyping, efficient product iterations, and seamless scalability from prototype to production.
     
  • Reduced Time-to-Market: Time is often a critical factor in product development. Computer on Modules significantly reduce time-to-market by providing a ready-to-use hardware platform. With pre-integrated components and standardized interfaces, developers can focus on software development and application-specific customization, accelerating the product development cycle and ensuring a competitive edge in the market.
     
  • Reliability and Longevity: Embedded systems are expected to perform reliably in various environments and over extended periods. COMs excel in this aspect, providing a stable and consistent hardware foundation. The carrier board remains unchanged when upgrading the COM, ensuring compatibility and simplifying long-term maintenance and support. Additionally, COMs are built to withstand demanding industrial conditions, including extended temperature ranges, shock and vibration resistance, and high reliability standards.
     
  • Cost Optimization: Computer on Modules offer significant cost optimization benefits. By utilizing off-the-shelf COMs, developers can reduce upfront engineering costs associated with custom board design. Additionally, the modularity of COMs allows for easy hardware upgrades without the need for an entire system replacement. This scalability not only saves costs in the long run but also enables the reuse of carrier board designs across multiple product lines or variants, maximizing return on investment.

SECO offers a wide range of both standard and proprietary off-the-shelf embedded modules to provide a versatile and efficient solution for developing embedded systems. With their scalability, flexibility, reduced time-to-market, reliability, and cost optimization advantages, SECO COMs empower developers to focus on their core expertise and create innovative applications for a wide range of industries.

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  1. SOM-SMARC-ASL
    SOM-SMARC-ASL
    SMARC® Rel 2.1 compliant module with Intel Atom® Processors x7000RE Series for the Edge
  2. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
  3. SOM-COMe-BT6-MTL
    SOM-COMe-BT6-MTL
    COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
  4. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
  5. SOM-SMARC-MX95
    SOM-SMARC-MX95
    SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors
  6. SOM-SMARC-QCS5430
    SOM-SMARC-QCS5430
    SMARC® 2.1.1 module with Qualcomm® QCS5430 processor
  7. SOM-SMARC-QCS6490
    SOM-SMARC-QCS6490
    SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor
  8. SOM-SMARC-Genio510
    SOM-SMARC-Genio510
    SMARC® Rel. 2.1.1 module with MediaTek Genio 510 Applications Processors
  9. SOM-SMARC-EHL
    SOM-SMARC-EHL
    SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. (HALLEY - C93)
  10.  SOM-COM-HPC-A-TGL-H
    SOM-COM-HPC-A-TGL-H
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)

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