Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

Items 1-10 of 12

Page
per page
Set Descending Direction
  1. Trizeps VII SX
    Trizeps VII SX
    SODIMM-200 CPU-Module with NXP i.MX 6SoloX Application Processor
  2.  Trizeps VII
    Trizeps VII
    SODIMM-200 CPU-Module with NXP i.MX6 Applications Processors
  3. Myon II
    Myon II
    Micro CPU module with NXP i.MX 8M Mini & i.MX8M Nano Applications Processors
  4. Trizeps VIII Plus
    Trizeps VIII Plus
    SODIMM-200 CPU-Module with NXP i.MX 8M Plus Applications Processors
  5. Trizeps VIII
    Trizeps VIII
    SODIMM-200 CPU-Module with NXP i.MX 8M Applications Processors
  6. Trizeps VIII Mini
    Trizeps VIII Mini
    SODIMM-200 CPU-Module with NXP i.MX 8M Mini Applications Processors
  7. ARCALIS
    ARCALIS
    Qseven® Rel. 2.1 module with NXP i.MX 8X Applications Processors
  8. NEMBUS
    NEMBUS
    μQseven® module with NXP i.MX 6 Processors
  9. SWAN
    SWAN
    SMARC® Rel. 2.1.1 module with NXP i.MX 8X Applications Processors
  10. LEXELL
    LEXELL
    SMARC® Rel. 2.1.1 module with NXP i.MX 8M Applications Processors

Items 1-10 of 12

Page
per page
Set Descending Direction