Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

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  1. LAGOON
    LAGOON
    COM-HPC® Client module Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications
  2. CARINA
    CARINA
    COM-HPC® Client module Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors

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