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USA 我们的产品
面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。
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DEV-KIT-Trizeps-i-PAN-T7-IIHMI for Trizeps SODIMM SOMs -
DEV-KIT-Trizeps-i-PAN-7HMI for Trizeps SODIMM SOMs -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules -
Carrier-COMe-T6-E10Carrier Board for COM-Express® Rel. 3.1 Type 6 Modules for Development -
DEV-KIT-COMe-T7Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 7 modules. -
DEV-KIT-COMe-T6Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 6 modules -
Carrier-COMe-T6-C30Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor -
DEV-KIT-SMARCSMARC 2.0 / 2.1 / 2.1.1 Development Kit. (SMARC DEV KIT) -
SOM-SMARC-EHLSMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. (HALLEY - C93) -
DEV-KIT-Q7-2.1Cross Platform Starter Kit compatible with both x86 and Arm Rel. 2.0 / 2.1 Qseven® modules . (Q7 STARTER KIT 2.1)
