产品详情
说明 | The Development Kit contains the following material: - CSM-B79 Carrier Board - Serial Adapter Cables - 1x SATA power cable - Main power Adapter cable - 1x certified High Speed DP cable, DP1.4 standard compliant - 1x certified High Speed HDMI® cable, HDMI® 2.0 compliant - DP-to-HDMI® adapter - 1x eDP cable Module not included. Must be purchased separately |
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视频界面说明 | LVDS/MIPI-DSI connector, interface shared with 2x eDP connectors |
大容量存储器说明 | SATA M 7p connector with dedicated power connector, |
网络说明 | Up to 2xDual RJ-45 Gigabit Ethernet connectors |
USB说明 | 1 x USB 3.0 type A Socket |
Pci Description | PCI-e x4 slot, interface shared with M.2 Slots |
音频说明 | TRSS Mic In + Line Out Audio Jack I2S Audio header |
串行端口 | 2 x CAN ports |
其他接口 | eSPI pin header + Flash Socket |
电源 | 9-24V through dedicated Mini-Fit Jr 2x2 power connector or USB Type-C connector RTC Coin cell battery holder |
操作温度说明 | -40°C ÷ +85°C (industrial range)
*All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. |
尺寸 | 243.84 x 243.84mm (microATX) |
KTDV-SM-B79.00 | 部件编号说明 SMARC Cross Platform Development Kit |