DEV-KIT-Trizeps-i-PAN-T7-II

HMI for Trizeps SODIMM SOMs

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中央处理器说明	Depends on compatible Trizeps SODIMM SOMs • NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX ARM Cortex A9 up to 1.0 GHz on Trizeps VII SOM • NXP i.MX 8M ARM Cortex A53 up to 1.5 GHz, up to Quad Core, integrated ARM Cortex M4 on Trizeps VIII SOM • NXP i.MX 8M Mini ARM Cortex A53 up to 1.8 GHz, up to Quad Core, integrated ARM Cortex M4 on Trizeps VIII Mini SOM • NXP i.MX 8M Nano ARM Cortex A53 up to 1.5 GHz, up to Quad Core, integrated ARM Cortex M7 on Trizeps VIII Nano SOM • NXP i.MX 8M Plus ARM Cortex A53 up to 1.8 GHz, up to Quad Core, integrated ARM Cortex M7 on Trizeps VIII Plus SOM
图形说明	Depends on compatible Trizeps SODIMM SOMs
视频界面说明	MIPI-CSI Camera connector
视频分辨率说明	7.0 inch LVDS Display, IPS technology, resolution 1024 x 600, LED lifetime min. 30k hours, typ. 500 cd/qm brightness, P-Cap (Projected Capacitive touch screen), Glass thickness 1.8 mm
大容量存储器说明	μSD Card Socket
网络说明	Gigabit Ethernet RJ45 connector Wireless functionalities depend on Trizeps SODIMM SOMs: • Trizeps VII: Onboard WiFi/BT Modul, IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), BT 3.0+ EDR • Trizeps VIII and Trizeps VIII Mini/Plus: Onboard WiFi/BT module, WiFi 2.4GHz/5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 5.0
USB说明	USB 2.0 Host, μUSB 2.0 OTG / USB via i-MOD extension connector
音频说明	3,5 mm Headset Jack for Microphone and Headphone Solderpads for Speaker (2.6 W Audio Amplifier), Headphone, Microphone
串行端口	UART via i-MOD extension connector
其他接口	I2C, CAN, Keys via i-MOD extension connectors SPI via solderpads Realtime Clock with Backup Cap LED Powerfail Detection
电源	Industrial +12 up to 24V supply / Power over Ethernet (POE) on request
操作系统	Microsoft Windows 10 IoT, Linux, Android
操作温度说明	-20 ÷ 70°C
尺寸	178.0 x 108.7 x 27.6 mm (include housing)