我们的产品

面向最具创新性项目的一系列广泛的 SECO 产品:模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案,以及载板、入门套件和所有能有助完成您的项目的配件。

项目 11013

页面
每页
设置降序方向
  1. SOM-SMARC-ASL
    SOM-SMARC-ASL
    符合SMARC® Rel 2.1标准的模块,采用用于Edge应用的Intel Atom® x7000RE系列处理器
  2. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
  3. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  4. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  5. SBC-pITX-EHL
    SBC-pITX-EHL
    Pico-ITX SBC with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (ICARUS - D63)
  6. SOM-COM-HPC-A-RPL
    SOM-COM-HPC-A-RPL
    COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
  7. Titan 290 EHL
    Titan 290 EHL
    Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codeame: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)
  8. Titan 300 TGL-UP3 AI
    Titan 300 TGL-UP3 AI
    不带风扇的嵌入式计算机,配备第11代英特尔® Core™和英特尔® Celeron® SoCs(代号:Tiger Lake UP3)以及Axelera AI芯片:由单个Metis AIPU提供动力,最高可达120 TOPS
  9.  SOM-COM-HPC-A-TGL-H
    SOM-COM-HPC-A-TGL-H
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)
  10. SOM-COMe-CT6-EHL
    SOM-COMe-CT6-EHL
    COM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake). (EUPHORIA - E37)

项目 11013

页面
每页
设置降序方向