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面向最具创新性项目的一系列广泛的 SECO 产品:模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案,以及载板、入门套件和所有能有助完成您的项目的配件。

项目 11031

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  1. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
  2. SOM-COMe-BT6-MTL
    SOM-COMe-BT6-MTL
    COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
  3. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
  4. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  5. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  6. SOM-COM-HPC-A-RPL
    SOM-COM-HPC-A-RPL
    COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
  7. Krater RV1000
    Krater RV1000
    Embedded Computer for Digital Signage applications with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (KRATER - SYS-C90-DS)
  8. Titan 300 TGL-UP3
    Titan 300 TGL-UP3
    Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)
  9. Titan 300 TGL-UP3 AI
    Titan 300 TGL-UP3 AI
    不带风扇的嵌入式计算机,配备第11代英特尔® Core™和英特尔® Celeron® SoCs(代号:Tiger Lake UP3)以及Axelera AI芯片:由单个Metis AIPU提供动力,最高可达120 TOPS
  10. SBC-pITX-BT
    SBC-pITX-BT
    Pico-ITX SBC with Intel® Atom™ E3800 (codename: Bay Trail) Processors. (LAMPOS - A44)

项目 11031

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