DEV-KIT-COMe-T7

Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 7 modules.

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说明	The Development Kit contains the following material: - CCOMe-C79 Carrier Board - 1x Serial Adapter Cables - 1x SATA cable - Front Panel module V995 with connecting cables Module not included. Must be purchased separately
大容量存储器说明	2x SATA 7p M connectors µSD Card slot (interface multiplexed with GPIO header)
网络说明	1x GbEthernet RJ-45 connector 4x 10Gbase-KR interfaces on OCP Type-C connector 4x MDIO I2C interfaces on internal pin header 4x SDP interfaces on SMA RF connectors
USB说明	4x USB 3.1 Host ports on Dual Type-A sockets
串行端口	2 x RS-232 ports on dedicated pin header (from module)
其他接口	BMC connector with SM Bus, I2C, LPC, 1x USB 2.0, 1x PCI-e x1, NCSI signals 4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot) SPI Flash Socket Button / LEDs front panel header 4-pin tachometric FAN connector I2C + SM Bus on feature Pin header I2C Flash Socket SM Bus Smart Battery Connector 4 x 7-segment LCD displays for POST codes LPC/eSPI internal header USB Overcurrent header JTAG connector FuSa header SPI Flash header Buzzer
电源	ATX 24 poles connector for carrier board working only Auxiliary 12V connector for carrier board working only 12 VDC power in connector for COM Express module’s working Cabled Coin-cell connector for RTC
操作温度说明	0° ÷ +60°C (commercial version) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
尺寸	305x244 mm (ATX form factor, 12" x 9.6")