Carrier-COMe-T6-C30

Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor

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说明	The Carrier-COMe-T6-C30 is a full-featured Carrier Board for COM-Express™ Type 6 Modules on 3.5” form factor. Specifically designed for digital signage, but also highly versatile; it is an extremely compact and I/O rich solution, offering a wide range of connectivity possibilities, excellent for multi-display applications.
视频界面说明	1 x DP++ connector 2 x miniDP++ connectors LVDS 24-bit Single/Dual Channel LVDS External EDID flash socket eDP 4-lanes 40 poles VESA connector
大容量存储器说明	S-ATA 7p M connector + 4 pins power connector M.2 Socket 2 2260 Key B slot for SSD M.2 Socket 3 2280 Key M slot for PCI-e x4 SSDs μSD Card slot (interface multiplexed with GPIO header)
网络说明	Dual RJ-45 connector (1 port managed by COM Express Gigabit Ethernet interface, 1 port managed by Carrier board’s Intel® I21x GbEthernet controller) M.2 Socket 2 2242 / 3042 Key B slot for WWAN modules (modem) M.2 Socket 1 2230 Key E slot for WiFi / BT modules
USB说明	3 x USB 3.0 Host ports on Type-A sockets 2 x USB 2.0 Host ports on Type-A sockets 1 x USB 2.0 Host port on internal pin header
音频说明	On-board HD Audio Codec (Realtek ALC262) Mic In + Line Out internal pin header
串行端口	2 x RS-232 / RS-422 / RS-485 ports on internal pin header (from carrier board’s SuperI/O) 2 x RS-232 ports on feature pin header (from module)
其他接口	microSIM slot for M.2 modem 4 x GPI + 4 x GPO pin header (interface multiplexed with μSD slot) Button / LEDs front panel header 3-pin tachometric FAN connector I2C + SM Bus on feature Pin header LPC internal header
电源	19÷24 VDC fixed (only CPU modules with max 45W TDP supported) Mega-Fit® 2x1 Power Connector Cabled Coin-cell connector for RTC
操作温度说明	0°C ÷ +50°C *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
尺寸	146x102mm (3.5” form factor, 5.75” x 4.02”)