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面向最具创新性项目的一系列广泛的 SECO 产品:模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案,以及载板、入门套件和所有能有助完成您的项目的配件。

项目 11040

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  1. SOM-SMARC-ASL
    SOM-SMARC-ASL
    符合SMARC® Rel 2.1标准的模块,采用用于Edge应用的Intel Atom® x7000RE系列处理器
  2. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    采用Intel Atom® x7000E系列处理器(代号:Amston Lake和Alder Lake N)的COM Express® 3.1 Type 6紧凑型模块
  3. SOM-COMe-BT6-MTL
    SOM-COMe-BT6-MTL
    COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
  4. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
  5. SOM-SMARC-QCS5430
    SOM-SMARC-QCS5430
    SMARC® 2.1.1 module with Qualcomm® QCS5430 processor
  6. SOM-SMARC-QCS6490
    SOM-SMARC-QCS6490
    SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor
  7. SOM-SMARC-Genio510
    SOM-SMARC-Genio510
    SMARC® Rel. 2.1.1 module with MediaTek Genio 510 Applications Processors
  8. SBC-3.5-RV1000
    SBC-3.5-RV1000
    3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)
  9. SBC-pITX-EHL
    SBC-pITX-EHL
    Pico-ITX SBC with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (ICARUS - D63)
  10. SOM-COM-HPC-A-TGL-UP3
    SOM-COM-HPC-A-TGL-UP3
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)

项目 11040

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