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无风扇嵌入式计算机

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Edge AI Mission System

Edge AI Mission System

Vision, speech and multimodal AI running entirely on-device. Fanless, battery-powered, offline-first.
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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

无风扇嵌入式计算机

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Cpu Maker
  1. Intel 10 items
  2. NXP 3 items
  3. Qualcomm 1 item
  4. Rockchip 1 item
  5. Espressif 1 item
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 4 items
Cpu Type
  1. Espressif ESP32-D0WD 1 item
  2. Intel® Atom™ 5 items
  3. Intel® Celeron® 5 items
  4. Intel® Core™ 4 items
  5. Intel® Pentium® 3 items
  6. NXP i.MX 8M 1 item
  7. NXP i.MX 93 2 items
  8. Rockchip RK3399 1 item
Ethernet
  1. ETHERNET≥1 10 items
  2. ETHERNET≥2 14 items
Form Factor
  1. ESP32 1 item
  2. Boxed Solutions 13 items
  3. Single Board Computer 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 5 items
Form Factor Specification
  1. ESP32 form factor 1 item
Memory
  1. memory ≤1 11 items
  2. memory ≤16 4 items
  3. memory ≤2 11 items
  4. memory ≤4 9 items
  5. memory ≤8 8 items
  6. memory ≥32 4 items
  7. soldered down 8 items
  8. SO_DIMM 4 items
Mass Storage
  1. onboard SSD 1 item
  2. M.2 NVMe SSD slot 1 item
  3. M.2 SATA SSD slot 7 items
  4. microSD card slot 2 items
  5. onboard eMMC 5 items
  6. onboard eMMC 5 items
  7. SATA channels ≥ 1 4 items
  8. SATA channels ≥ 2 2 items
  9. SATA channels ≥ 3 2 items
  10. SATA channels ≥ 4 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -20°C ÷ +70°C 1 item
  3. 0°C ÷ +50°C 11 items
  4. 0°C ÷ +60°C 6 items
  5. 20°C ÷ +70°C 3 items
  6. -40°C ÷ +60°C 1 item
  7. -20°C ÷ +70°C 1 item
  8. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 6 items
  2. USB 2.0 ≥ 2 6 items
  3. USB 3.0 ≥ 1 6 items
  4. USB 3.0 ≥ 2 3 items
  5. USB 3.1 ≥ 1 1 item
  6. USB 3.2 ≥ 1 3 items
  7. USB 3.2 ≥ 2 4 items
  8. USB CLIENT 1 item
  9. USB OTG 2 items
Video Interfaces
  1. DP 4 items
  2. DP++ 7 items
  3. HDMI 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 7 items
  2. M.2 SOCKET 2 KEY 5 items
  3. M.2 Socket 2 key B 5 items
  4. ONBOARD WI-FI/BLE 7 items