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SOM-COMe-BT6-PTLCOM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)x86 COM Express® Processore Intel AI-Optimized Hardware -
Titan 300 TGL-UP3 AIComputer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPSx86 Processore Intel Fanless Embedded PCs AI-Optimized Hardware -
SOM-SMARC-ADL-NComputer on Module (CoM) SMARC® Rel. 2.1.1 con processori Intel® Atom® serie x7000E, Intel® Core™ i3, Intel® Serie N (Codename: Alder Lake N). (FINLAY - E08)x86 Computer on Module SMARC® Processore Intel -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Processore Intel -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)x86 COM Express® Processore Intel -
SOM-COMe-CT6-ASLCOM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Amston Lake)x86 COM Express® Processore Intel