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SOM-SMARC-ADL-N
Computer on Module (CoM) SMARC® Rel. 2.1.1 con processori Intel® Atom® serie x7000E, Intel® Core™ i3, Intel® Serie N (Codename: Alder Lake N).
(FINLAY - E08)
Cpu
Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) targeted for IoT and multimedia applications
Grafica
Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
Connettività
2 x NBase-T (2.5GbE supported); 2x USB 3.2 Gen 2; 6x USB 2.0; 4x PCI-e Gen3 lanes with optional SERDES
Memoria
Quad Channel LPDDR5 soldered down with IBECC
Dettagli Prodotto
Descrizione
|
Computer on Module (CoM) SMARC® Rel. 2.1.1 con processori Intel® Atom® serie x7000E, Intel® Core™ i3, Intel® Serie N (precedentemente noti come Alder Lake N) |
|---|---|
Cpu
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Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Alder Lake N): · Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W TDP, with TSN and TCC* · Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W TDP, with TSN and TCC* · Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP, with TSN and TCC* · Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP · Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP · Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP · Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP * Time Sensitive Network and Time Coordinate Computing |
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Memoria
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Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code) |
|
Grafica
|
Integrated Intel® UHD Graphics driven by Intel® Xe architecture:
AVX256 & VNNI support for faster AI inference and media transcoding Support with up to 3 independent 4K60 SDR displays |
Interfacce video
|
Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution |
Risoluzione video
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Up to 4096x2160 @60Hz |
Memoria di massa
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1x external S-ATA Gen3.2 channel Optional eMMC 5.1 drive soldered on-board |
Rete
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2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
USB
|
6x USB 2.0 host ports 2x USB 3.2 Gen2 ports |
|
Pci
|
4x PCIe Gen3 lanes Possible channel aggregations:
|
Audio
|
HD Audio and Soundwire/i2S Audio interfaces |
Porte seriali
|
2x UARTs 2x HS-UARTs |
Altre interfacce
|
Up to 14x GPIOs SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals, watchdog |
Dispositivo di alimentazione
|
+5VDC and +3VDC for RTC |
Sistema operativo
|
Microsoft® Windows 10 Linux Kernel LTS |
Temperatura operativa
|
0°C to +60°C (Commercial version) *
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature depends on the application, enclosure, and/or environment. It is the customer’s responsibility to implement an application-specific cooling solution for the customer’s system that keeps the heat spreader temperature in the range indicated. |
Dimensioni
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50 x 82 mm |
| EE08-6842-2111-C1 | Descrizione Part Number SMARC 2.1 w/ Alder Lake N Intel® Core i3 N305, 16GB RAM d.c., 64GB eMMC, x2Eth, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q1.2 (CFG H0) - ind, SPI1 GP SPI |
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