Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

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Cpu

11th Gen Intel® Core™ processors and Intel® Celeron® SoCs

Grafica

Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays

Connettività

2x 2.5 GbE, Optional M.2 WWAN and WLAN modules

Memoria

Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC

Dettagli Prodotto

Informazioni tecniche

Descrizione	Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS
Cpu	Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP) Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP) Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial AI Chip: 100+ TOPS inference power - Voyager SDK for effortless deployment of AI applications
Memoria	2x DDR4-3200 SODIMM slots Up to 64GB (IBECC supported only with Core™ industrial SoCs)
Grafica	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities Support for up to four independent displays at up to 4K60 HDR resolution or one display at 8K resolution
Interfacce video	2x Multimode DisplayPort 1.4, on dual DP++ connector 2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
Risoluzione video	DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp
Memoria di massa	On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
Rete	2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* *Certification upon request
USB	2x Superspeed USB 10Gbps ports on Dual Type-A sockets 2x Superspeed USB 20Gbps on USB Type-C slots
Audio	Lineout + MicIn combo TRRS Audio Jack
Porte seriali	2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
Altre interfacce	Optional 2x 12 poles terminal block connectors with the following I/O: • 8x GPIOs • 1x I2C • 1x SPI • 1x 5V • 1x 3.3V • 1x 12V • 3x GND Power ON Button Optional TPM 1.2/2.0 module on-board
Dispositivo di alimentazione	12VDC to 24VDC range, Mega-Fit 2p RA Connector Coin cell battery for RTC On-Board
Sistema operativo	Microsoft® Windows 10 IoT Enterprise LTSC 2021 Linux (Kernel ≥ 5.4 version)
Temperatura operativa	Commercial range: 0°C to +40°C, with 0.7m/s airflow Extended range: -30°C to +40°C, with 0.7m/s airflow **Up to 60°C with scaled down CPU TDP
Dimensioni	199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)