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SOM-COMe-CT6-P100

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

SOM-COMe-CT6-WHL-U

SOM-COMe-CT6-WHL-U

COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors. (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)

SOM-COMe-CT6-V2000

SOM-COMe-CT6-V2000

Computer on Module (CoM) COM Express® 3.0 Type 6 Compact con processori AMD Ryzen™ Embedded V2000. (OPHELIA - D21)

COM Express®

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Opzioni
Cpu Maker
  1. AMD 6 elementi
  2. Intel 14 elementi
  3. Qualcomm 1 elemento
  4. Rockchip 1 elemento
Cpu Power Consumption
  1. range 10-25 W 10 elementi
  2. range < 10 W 3 elementi
  3. range > 25 W 8 elementi
Cpu Type
  1. AMD EPYC™ Embedded 3 1 elemento
  2. AMD Ryzen™ Embedded 2 elementi
  3. AMD® Ryzen™ embedded 3 elementi
  4. Intel® Atom™ 5 elementi
  5. Intel® Celeron® 5 elementi
  6. Intel® Core™ 11 elementi
  7. Intel® Pentium® 3 elementi
  8. Intel® Xeon® 1 elemento
  9. Rockchip RK3588 1 elemento
  10. Qualcomm Dragonwing IQ-X 1 elemento
Ethernet
  1. ETHERNET≥1 19 elementi
  2. ETHERNET≥2 2 elementi
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 elementi
  2. ≤ 100 x 100mm 12 elementi
  3. ≥ 100 x 100mm 4 elementi
  4. COM Express® 3 elementi
Form Factor Specification
  1. COM Express Basic 8 elementi
  2. COM Express Compact 13 elementi
Memory
  1. memory ≤1 13 elementi
  2. memory ≤16 12 elementi
  3. memory ≤2 14 elementi
  4. memory ≤4 14 elementi
  5. memory ≤8 14 elementi
  6. memory ≥32 15 elementi
  7. soldered down 1 elemento
  8. SO_DIMM 16 elementi
  9. I2C EEPROM 1 elemento
  10. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 elemento
Mass Storage
  1. CFAST slot 1 elemento
  2. I2C EEPROM 1 elemento
  3. M.2 NVMe SSD slot 2 elementi
  4. M.2 SATA SSD slot 2 elementi
  5. microSD card slot 3 elementi
  6. onboard eMMC 8 elementi
  7. SATA channels ≥ 1 16 elementi
  8. SATA channels ≥ 2 15 elementi
  9. SATA channels ≥ 2 1 elemento
  10. SATA channels ≥ 2 3 elementi
  11. SATA channels ≥ 3 3 elementi
  12. SATA channels ≥ 4 1 elemento
  13. SD interface 2 elementi
  14. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 11 elementi
  2. -20°C ÷ +70°C 2 elementi
  3. -40°C ÷ +85°C 14 elementi
  4. 0°C ÷ +50°C 13 elementi
  5. 0°C ÷ +60°C 20 elementi
  6. 20°C ÷ +70°C 8 elementi
  7. -20°C ÷ +70°C 3 elementi
Pci Express
  1. PCI-e lanes ≥ 1 15 elementi
  2. PCI-e lanes ≥ 2 15 elementi
  3. PCI-e lanes ≥ 3 15 elementi
  4. PCI-e lanes ≥ 4 16 elementi
  5. PCI-e lanes ≥ 5 18 elementi
Ttl Uarts
  1. TTL Uarts ≥1 14 elementi
  2. TTL Uarts ≥2 16 elementi
USB
  1. USB 2.0 ≥ 1 14 elementi
  2. USB 2.0 ≥ 2 13 elementi
  3. USB 2.0 ≥ 3 13 elementi
  4. USB 2.0 ≥ 4 13 elementi
  5. USB 2.0 ≥ 5 13 elementi
  6. USB 2.0 ≥ 6 15 elementi
  7. USB 3.0 ≥ 1 10 elementi
  8. USB 3.0 ≥ 2 10 elementi
  9. USB 3.0 ≥ 3 10 elementi
  10. USB 3.0 ≥ 4 7 elementi
  11. USB 3.1 ≥ 1 6 elementi
  12. USB 3.1 ≥ 2 6 elementi
  13. USB 3.2 ≥ 1 1 elemento
  14. USB 3.2 ≥ 2 2 elementi
  15. USB 4.0 ≥ 2 3 elementi
  16. USB CLIENT 2 elementi
  17. USB OTG 4 elementi
Video Interfaces
  1. DDI 17 elementi
  2. DP 14 elementi
  3. DP++ 2 elementi
  4. DUAL CHANNEL LVDS 16 elementi
  5. eDP 19 elementi
  6. HDMI 17 elementi
  7. MIPI-CSI camera conn 3 elementi
  8. PARALLEL RGB 1 elemento
  9. SINGLE CHANNEL LVDS 15 elementi
  10. VGA 5 elementi
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 elemento