SOM-COMe-CT6-ASL

COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)

Disponibile nell'intervallo di temperatura industriale

Data sheet

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Cpu

Intel® Atom® Processors x7000E Series, Intel® Processor N series and Intel® Core™ i3 N305 Processor

Grafica

Integrated Intel® Gen12 UHD graphics controller with up to 32 EU

Connettività

1x NBase-T 2.5GbE; up to 2x USB 10Gbps + 3x USB 5Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen3

Memoria

One SO-DIMM slot supporting DDR5-4800 IBECC memory, up to 16GB

Dettagli Prodotto

Informazioni tecniche

Descrizione	COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
Cpu	Intel® Atom® Processors x7000RE (Codename: Amston Lake) Series: Intel Atom® x7835RE Eight Core @ 1.3GHz (3.6GHz turbo) 12W TDP w/ TSN and TCC, industrial Intel Atom® x7433RE Quad Core @ 1.5GHz (3.4GHz turbo) 9W TDP w/ TSN and TCC, industrial Intel Atom® x7213RE Dual Core @ 2GHz (3.4GHz turbo) 9W TDP w/ TSN and TCC, industrial Intel Atom® x7211RE Dual Core @ 1GHz (3.2GHz turbo) 6W TDP w/ TSN and TCC, industrial Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded E Series: Intel Atom® x7425E Quad Core @1.5GHz (3.4GHZ turbo) 12W TDP w/ TSN and TCC, commercial Inte Atom® x7213E Dual Core @1.7GHz (3.2GHZ turbo) 10W TDP w/ TSN and TCC, commercial Intel Atom® x7211E Dual Core @1GHz (3.2GHZ turbo) 6W TDP w/ TSN TCC, commercial Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) PC Client Processors Intel® Core™ i3-N305 Eight Core @1GHz / 1.8GHz (3.8GHZ turbo) 9W/15W TDP w/o TSN and w/o TCC, commercial Intel® Processor N200 Quad Core @1GHz (3.7GHZ turbo) 6W TDP w/o TSN and w/o TCC, commercial Intel® Processor N97 Quad Core @2GHz (3.6GHZ turbo) 12W TDP w/o TSN and w/o TCC, commercial Intel® Processor N50 Dual Core @1GHz (3.4GHZ turbo) 6W TDP w/o TSN and w/o TCC, commercial () TCC: Time Coordinated Computing (*) TSN: Time Sensitive Networking
Memoria	One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB (*) IBECC: In-Band Error-Correcting Code memory
Grafica	Integrated Intel® Gen12 UHD graphics controller with up to 32 EU Support up to 3 independent displays
Interfacce video	2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C 1x DDI Interface supporting DP / HDMI® 1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives)
Risoluzione video	HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b DP 1.4, eDP 1.4: 4096x2304@60 Hz LVDS up to 1920x1200 @ 60Hz
Memoria di massa	Up to 2x S-ATA Gen3 channels Optional eMMC 5.1 drive soldered on-board
Rete	1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN
USB	Up to 2x USB 10Gbps Optional 3x USB 5Gbps 8x Hi-Speed USB ports
Pci	Up to 6x PCI-e Gen3 lanes
Audio	HD Audio interface SoundWire Interface
Porte seriali	2x UARTs
Altre interfacce	SPI, 2x I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 1.2/2.0 on-board LID#/SLEEP#/PWRBTN#, watchdog 4x GPI, 4x GPO Optional 2x CSI camera interfaces
Dispositivo di alimentazione	+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Sistema operativo	Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Clea OS (Yocto)
Temperatura operativa	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) * Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensioni	95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)