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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Lüfterloser Embedded-Computer mit den Intel® Core™ und Intel® Celeron® SoCs der 11. Generation (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Lüfterloser Embedded-Computer mit Intel® Atom® X6000E-Serie, Intel® Pentium® und Celeron® N- und J-Serie (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Lüfterlose Embedded PCs

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  1. Intel® Atom™ 1 item
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  3. Intel® Core™ 3 items
  4. Intel® Pentium® 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 4 items
Memory
  1. memory ≤1 3 items
  2. memory ≤16 4 items
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  4. memory ≤4 3 items
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  6. memory ≥32 3 items
  7. soldered down 1 item
  8. SO_DIMM 3 items
Mass Storage
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  2. onboard eMMC 1 item
  3. SATA channels ≥ 1 2 items
  4. SATA channels ≥ 2 2 items
  5. SATA channels ≥ 3 2 items
  6. SATA channels ≥ 4 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. 0°C ÷ +50°C 3 items
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  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 1 item
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USB
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  5. USB 3.1 ≥ 1 1 item
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  7. USB 3.2 ≥ 2 4 items
  8. USB CLIENT 1 item
  9. USB OTG 2 items
Video Interfaces
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  2. DP++ 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 2 items