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Titan 300 TGL-UP3
Höhepunkte
GraphicsIntel® Iris® Xe Architektur mit bis zu 96 EUs, bis zu 4 unabhängige Displays
MemoryZwei DDR4 SO-DIMM-Steckplätze, die DDR4-3200 ECC-Speicher mit IBECC unterstützen
Lüfterloser Embedded-Computer mit den Intel® Core™ und Intel® Celeron® SoCs der 11. Generation (codename: Tiger Lake UP3)
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Application Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
Beschreibung
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Lüfterloser Embedded-Computer mit den Intel® Core™ und Intel® Celeron® SoCs der 11. Generation (codename: Tiger Lake UP3) |
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CPU Description
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Intel® Core™ i7-1185G7E, Quad Core @ 2,8 GHz (4,4 GHz Turbo) mit HT, 12 MB Cache, 28 W TDP (12 W cTDP) |
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Max Cores
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4 |
Memory Description
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2x DDR4-3200 SODIMM-Steckplätze |
Graphics Description
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Bis zu zwei Videodekodierboxen (VDBoxen) für erweiterte Videostream-Funktionen |
Video Interfaces Description
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2x Multimode DisplayPort 1.4, an dualem DP++-Anschluss |
Video Resolution Description
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DP: bis zu 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp mit DSC |
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Mass Storage Description
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On-Board NMVe Drive, bis zu 2 Module mit einer Gesamtkapazität von bis zu 1 TB |
Networking Description
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2x 2.5 Gigabit Ethernet RJ45 connectors Optionales integriertes M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 Modul, inklusive Dipol-Antennen* Optionales integriertes M.2 LTE-Modem mit Mini-SIM-Steckplatz, inklusive Dipol-Antennen* *Zertifizierung auf Anfrage |
USB Description
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2x Superspeed-USB-10Gbps-Anschlüsse an Dual-Type-A-Buchsen |
Audio Description
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Lineout + MicIn combo TRRS Audio Jack |
Serial Ports
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2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
Other Interfaces
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Optional 2x 12-polige Klemmenleisten mit folgenden
Power ON Taste |
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Power Supply
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12VDC to 24VDC range, Mega-Fit 2p RA Connector |
Operating System
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Microsoft® Windows 10 IoT Enterprise LTSC |
Operating Temperature Description
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Commercial range: 0 °C ÷ +50 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W) Industrial range: -40 °C ÷ +60 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W)
*The values indicated refer to the maximum temperature of the environment of use of the device. It is the customer’s responsibility to verify that the temperature remains within the admissible range indicated in this manual and, if necessary, adopt any passive cooling solution together with an application-dependent cooling system that can ensure that the heat sink temperature will not damage the device itself and/or the connected mechanical parts. |
Dimensions
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199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-Schienen- oder Wandmontagehalterungen (werkseitige Alternativen) |
Teilenummer
Standard IPC system with SBC-D64-3.5"- Intel i5-1145GRE 2.6GHz 4c-8GB RAM-256GBSSD-Linux -Ext.Temp
Standard IPC system with SBC-D64-3.5"- Intel i3-1115G4E 3GHz 2c-8GB RAM-256GBSSD-Linux -Comm.Temp
Standard IPC system with SBC-D64-3.5"- Intel i7-1185GRE 2.8GHz 4c-2x16GB RAM-512GBSSD-Linux -Ext.Temp
Standard IPC system with SBC-D64-3.5"- Intel 6305E 1.8GHz 2c-4GB RAM-128GBSSD-Linux -Comm.Temp