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SOM-SMARC-MX952

SOM-SMARC-MX952

SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
/images/fanless-pc/palladio-500-rpl-ai-main.jpg

Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

AI-Optimized Hardware

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Cpu Maker
  1. Intel 8 items
  2. MediaTek 2 items
  3. NXP 3 items
  4. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 3 items
  3. Intel® Core™ 7 items
  4. Intel® Pentium® 1 item
  5. Intel® Xeon® 1 item
  6. MediaTek Genio 510 1 item
  7. MediaTek Genio 700 1 item
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX 95 1 item
  10. Qualcomm® QCS5430 1 item
  11. Qualcomm® QCS6490 1 item
  12. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 14 items
  2. ETHERNET≥2 10 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 2 items
  3. SMARC 8 items
  4. Boxed Solutions 3 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. ≤ 100 x 100mm 7 items
  3. ≤ 80 x 80mm 2 items
Form Factor Specification
  1. COM Express Basic 2 items
  2. COM-HPC Client 2 items
  3. ≤ 100 x 100mm 1 item
Memory
  1. memory ≤1 10 items
  2. memory ≤16 5 items
  3. memory ≤2 11 items
  4. memory ≤4 10 items
  5. memory ≤8 10 items
  6. memory ≥32 6 items
  7. soldered down 6 items
  8. SO_DIMM 4 items
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. M.2 SATA SSD slot 4 items
  3. onboard eMMC 5 items
  4. onboard eMMC 3 items
  5. SATA channels ≥ 1 3 items
  6. SATA channels ≥ 2 4 items
  7. SATA channels ≥ 2 1 item
  8. SATA channels ≥ 3 2 items
  9. SATA channels ≥ 4 2 items
  10. SD interface 4 items
  11. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 9 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 8 items
  4. 0°C ÷ +50°C 9 items
  5. 0°C ÷ +60°C 13 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 6 items
Pci Express
  1. PCI-e lanes ≥ 1 8 items
  2. PCI-e lanes ≥ 2 8 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 3 items
Ttl Uarts
  1. TTL Uarts ≥1 7 items
  2. TTL Uarts ≥2 8 items
  3. TTL Uarts ≥3 6 items
USB
  1. USB 2.0 ≥ 1 8 items
  2. USB 2.0 ≥ 2 8 items
  3. USB 2.0 ≥ 3 8 items
  4. USB 2.0 ≥ 4 10 items
  5. USB 2.0 ≥ 5 6 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.1 ≥ 1 4 items
  10. USB 3.2 ≥ 1 4 items
  11. USB 3.2 ≥ 2 5 items
  12. USB 4.0 ≥ 1 1 item
  13. USB 4.0 ≥ 2 3 items
  14. USB 4.0 ≥ 4 1 item
  15. USB OTG 5 items
Video Interfaces
  1. DDI 3 items
  2. DP 5 items
  3. DP++ 3 items
  4. DUAL CHANNEL LVDS 6 items
  5. eDP 8 items
  6. HDMI 7 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 4 items
  9. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 8 items
  2. M.2 SOCKET 2 KEY 1 item
  3. ONBOARD WI-FI/BLE 3 items