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Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 4 items
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
  3. Myon MicroModule SOM 1 item
  4. SMARC 2 items
  5. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 80 x 80mm 1 item
  3. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. COM-HPC Client 1 item
Mass Storage
  1. standard SATA connector 1 item
  2. M.2 SATA SSD slot 3 items
  3. microSD card slot 5 items
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 3 items
  6. SATA channels ≥ 3 1 item
  7. SATA channels ≥ 4 1 item
  8. SD interface 2 items
Operating Temperature
  1. -40°C ÷ +85°C 4 items
  2. 0°C ÷ +60°C 2 items
  3. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 2 1 item
  2. PCI-e lanes ≥ 4 2 items
  3. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 4 2 items
  3. USB 2.0 ≥ 5 1 item
  4. USB 3.0 ≥ 1 2 items
  5. USB 3.0 ≥ 2 1 item
  6. USB 3.1 ≥ 1 1 item
  7. USB 3.1 ≥ 2 1 item
  8. USB 4.0 ≥ 4 1 item
  9. USB OTG 5 items
Video Interfaces
  1. DP 1 item
  2. DP++ 2 items
  3. DUAL CHANNEL LVDS 5 items
  4. eDP 1 item
  5. HDMI 5 items
  6. MIPI-CSI camera conn 1 item
  7. MIPI-DSI 1 item
  8. PARALLEL RGB 2 items
  9. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 2 items
Trägerplatine
  • COM Express Carrier Boards
  • COM-HPC Carrier Boards
  • Qseven Carrier Boards
  • SMARC Carrier Boards
  • Myon Carrier Boards
  • Trizeps Carrier Boards