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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway mit the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Lüfterloser Embedded-Computer mit den Intel® Core™ und Intel® Celeron® SoCs der 11. Generation (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Lüfterloser Embedded-Computer mit Intel® Atom® X6000E-Serie, Intel® Pentium® und Celeron® N- und J-Serie (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Lüfterlose Embedded PCs

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    SATA channels ≥ 1
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Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 2 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 2 items
  4. Intel® Pentium® 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 4 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 2 items
Memory
  1. memory ≤1 4 items
  2. memory ≤16 2 items
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. memory ≥32 2 items
  7. soldered down 2 items
  8. SO_DIMM 2 items
Mass Storage
  1. onboard SSD 1 item
  2. M.2 NVMe SSD slot 1 item
  3. M.2 SATA SSD slot 7 items
  4. microSD card slot 2 items
  5. onboard eMMC 5 items
  6. onboard eMMC 5 items
  7. SATA channels ≥ 1 4 items
  8. SATA channels ≥ 2 2 items
  9. SATA channels ≥ 3 2 items
  10. SATA channels ≥ 4 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. 0°C ÷ +50°C 4 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 3.0 ≥ 1 1 item
  4. USB 3.0 ≥ 2 1 item
  5. USB 3.2 ≥ 1 2 items
  6. USB 3.2 ≥ 2 2 items
Video Interfaces
  1. DP 3 items
  2. DP++ 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 2 items
  3. M.2 Socket 2 key B 2 items