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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

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Cpu Maker
  1. AMD 4 items
  2. Intel 20 items
Cpu Power Consumption
  1. range 10-25 W 8 items
  2. range < 10 W 5 items
  3. range > 25 W 6 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® Ryzen™ embedded 1 item
  4. Espressif ESP32-D0WD 1 item
  5. Intel® Atom™ 10 items
  6. Intel® Celeron® 10 items
  7. Intel® Core™ 11 items
  8. Intel® Pentium® 8 items
  9. Intel® Xeon® 1 item
Ethernet
  1. ETHERNET≥1 21 items
  2. ETHERNET≥2 9 items
Form Factor
  1. COM Express® 12 items
  2. COM-HPC® 3 items
  3. Qseven 1 item
  4. Single Board Compute 2 items
  5. SMARC 4 items
  6. Single Board Computer 1 item
  7. Single Board Computer 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 13 items
  2. ≤ 80 x 80mm 3 items
  3. ≥ 100 x 100mm 4 items
  4. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 4 items
  2. COM Express Compact 8 items
  3. COM-HPC Client 2 items
  4. Other SBCs 3 items
  5. Pico-ITX 1 item
  6. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 17 items
  2. memory ≤16 16 items
  3. memory ≤2 16 items
  4. memory ≤4 17 items
  5. memory ≤8 19 items
  6. memory ≥32 10 items
  7. soldered down 8 items
  8. SO_DIMM 15 items
Mass Storage
  1. standard SATA connector 3 items
  2. M.2 NVMe SSD slot 6 items
  3. M.2 SATA SSD slot 4 items
  4. microSD card slot 3 items
  5. onboard eMMC 2 items
  6. onboard eMMC 11 items
  7. SATA channels ≥ 1 16 items
  8. SATA channels ≥ 1 1 item
  9. SATA channels ≥ 2 2 items
  10. SATA channels ≥ 2 14 items
  11. SATA channels ≥ 3 1 item
  12. SATA channels ≥ 4 1 item
  13. SD interface 3 items
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 17 items
  4. 0°C ÷ +50°C 14 items
  5. 0°C ÷ +60°C 22 items
  6. 20°C ÷ +70°C 10 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 16 items
  2. PCI-e lanes ≥ 2 16 items
  3. PCI-e lanes ≥ 3 15 items
  4. PCI-e lanes ≥ 4 17 items
  5. PCI-e lanes ≥ 5 13 items
Ttl Uarts
  1. TTL Uarts ≥1 18 items
  2. TTL Uarts ≥2 24 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 16 items
  2. USB 2.0 ≥ 2 16 items
  3. USB 2.0 ≥ 3 15 items
  4. USB 2.0 ≥ 4 16 items
  5. USB 2.0 ≥ 5 14 items
  6. USB 2.0 ≥ 6 17 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 9 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 5 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 8 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 2 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
Video Interfaces
  1. DDI 12 items
  2. DP 12 items
  3. DP++ 10 items
  4. DUAL CHANNEL LVDS 13 items
  5. eDP 19 items
  6. HDMI 18 items
  7. MIPI-CSI camera conn 4 items
  8. MIPI-DSI 2 items
  9. SINGLE CHANNEL LVDS 11 items
  10. VGA 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 1 item
  3. ONBOARD WI-FI/BLE 1 item