SOM-SMARC-ASL
Produktbeschreibung
Beschreibung | SMARC®-kompatibles Modul gemäß Rel 2.1 mit Intel Atom® Prozessoren der Produktreihe x7000RE für den Edge |
---|---|
CPU | Intel Atom® Prozessoren der Produktreihe x7000RE (Codename: Amston Lake)
* Time Sensitive Network und Time Coordinate Computing |
Max. Kerne | 8 |
Speicher | Up to 16GB LPDDR5-4800 soldered down memory with IBECC (In-Band Error Correction Code) |
Grafiken | Integrated Intel® UHD Graphics driven by Intel® Xe architecture:
AVX256 & VNNI support for faster AI inference and media transcoding Support with up to 3 independent 4K60 SDR displays |
Videoschnittstellen | eDP 1.3 or dual channel 18/24bit LVDS interface (factory alternatives) 2x DP++ multimode DP 1.4 / HDMI® 2.1 interface 2x MIPI CSI-2 inputs (1 x 2-lanes and 1 x 4-lanes) |
Videoauflösung | Up to 4096x2160 @60Hz |
Massenspeicher | 1x external S-ATA Gen3.2 channel |
Networking | 2x NBase-T ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
USB | 6x Hi-Speed USB interfaces 2x USB 10Gbps interfaces |
Pci | 4x PCIe lanes Gen3 Possible channel aggregations:
|
Audio | HD audio and Soundwire / i2S audio interfaces |
Serielle Schnittstellen | 2x UARTs 2x HS-UARTs |
Andere Schnittstellen | Up to 14x GPIOs SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals Watchdog |
Stromversorgung | +5VDC and +3VDC for RTC |
Betriebssystem | Microsoft® Windows 10 Linux Kernel LTS |
Betriebstemperatur | -40°C ÷ +85°C (Industrial version) *
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Größe | 50 x 82 mm |
EE08-B232-2111-I1 | Beschreibung Teilenummer SMARC 2.1 w/ Amston Lake Intel® Atom x7213RE, 4GB RAM d.c., 32GB eMMC, x2Eth, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1) TPM SLB 9670 Q1.2 (CFG H0) - ind, SPI1 GP SPI | |
EE08-C232-2111-I1 | Beschreibung Teilenummer SMARC 2.1 w/ Amston Lake Intel® Atom x7433RE, 4GB RAM d.c., 32GB eMMC, x2Eth, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q1.2 (CFG H0) - ind, SPI1 GP SPI | |
EE08-D632-2122-I1 | Beschreibung Teilenummer SMARC 2.1 w/ Amston Lake Intel® Atom® x7835RE, 8GB RAM d.c., 64GB eMMC, x2Eth, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q2.0 (CFG H0) - Ind, eSPI |
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