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SOM-SMARC-EHL
Höhepunkte
GraphicsIntegrierter Gen11 UHD-Grafikcontroller, der 3 unabhängige Displays unterstützt
MemoryQuad Channel LPDDR4x gelöteter Speicher mit IBECC
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
DEV-KIT-SMARC
Beschreibung
|
SMARC® Rel. 2.1.1 Computer on Module (CoM) mit Intel® Atom® x6000E Serie und Intel® Pentium® und Celeron® N und J Serie (früher Elkhart Lake) Prozessoren für FuSa Anwendungen |
|---|---|
CPU Description
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Intel® Atom™ x6000E, Pentium® und Celeron® N- und J-Serie "Elkhart Lake" CPUs: (*) IHS: Integrierter Heatspreader; TCC: Zeitkoordiniertes Rechnen |
|
Max Cores
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4 |
Memory Description
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32-Bit LPDDR4x gelöteter Speicher |
Graphics Description
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Bis zu 3 unabhängige Displays |
Video Interfaces Description
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eDP 1.3 oder Dual Channel 18/24bit LVDS Schnittstelle (Fabrik Option) |
Video Resolution Description
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bis zu 4096x2160 @60Hz |
|
Mass Storage Description
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1 x external S-ATA Gen3 Channel |
Networking Description
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2x Gigabit Ethernet PHY mit präziser Taktsynchronisation und synchronem Ethernet-Taktausgang für IEEE 1588 (Safety Related - Black channel) |
USB Description
|
6 x USB 2.0 Host Anschluss |
PCI Description
|
bis zu 4 x PCI-e Gen3 Lanes |
Audio Description
|
HD Audio interface |
Serial Ports
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2 x HS-UARTs (Safety Related) |
Other Interfaces
|
SM Bus |
|
Power Supply
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+5VDC und +3.3V_RTC |
Operating System
|
Microsoft® Windows 10 Enterprise (64 bit) |
Operating Temperature Description
|
-40°C ÷ +85°C (Industrieversion)* *Gemessen an einem beliebigen Punkt des SECO Standard-Wärmeverteilers für dieses Produkt, zu jeder Zeit (einschließlich der Inbetriebnahme). Die tatsächliche Temperatur hängt stark von der Anwendung, dem Gehäuse und/oder der Umgebung ab. Der Kunde sollte anwendungsspezifische |
Dimensions
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50 x 82 mm |
Teilenummer
SOM-SMARC-EHL w/Intel® Pentium® J6426 (SKU2, QC up to 3.00 GHz, TDP 10W), 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS,HDMI, DP++, TPM 2.0, GenPurp SPI, Comm.Temp.
SOM-SMARC-EHL w/Intel® Atom® x6211E (SKU5, DC up to 3.00 GHz, TDP 6.0W), 4GB RAM, 32GB eMMC, 4x PCIe, LVDS + HDMI + DP++, TPM 2.0, GP SPI, Comm Temp
SOM-SMARC-EHL w/ Intel Atom® x6413E (SKU6 ,QC @ 3.0GHz, TDP 9W), w/ IBECC 4GB RAM, 16GB eMMC, SERDES, eDP/DP++/DP++, TPM 2.0,GP SPI, Ind Temp
SOM-SMARC-EHL w/Intel Atom® x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) w/IBECC 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
SOM-SMARC-EHL w/Intel Atom® x6212RE (SKU8, [email protected] GHz, TDP 6.0W), w/TCC and IBECC 4GB RAM, 32GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
SOM-SMARC-EHL w/Intel Atom® x6214RE (SKU9, [email protected] GHz, TDP 9.0W), w/TCC and IBECC 4GB RAM, 32GB eMMC, #4 PCIe x1 or #1 PCIe x4, eDP, HDMI, no TPM, GenPurp SPI, Ind. Temp.
SOM-SMARC-EHL w/Intel Atom® x6425RE (SKU10, [email protected] GHz, TDP 12W) w/TCC and IBECC 16GB RAM, 64GB eMMC, Opt #4 PCIE (w/ 1 x4),eDP, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
SOM-SMARC-EHL w/Intel Atom® x6425RE (SKU10, [email protected] GHz, TDP 12W) w/TCC and IBECC 16GB RAM, 64GB eMMC, SERDES, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
SOM-SMARC-EHL w/Intel Atom® x6200FE (SKU12, [email protected] GHz, TDP 4.5W),w/o Graphics, FuSa Certified, w/TCC and IBECC 4GB RAM, 32GB eMMC, LVDS, 2x DP++, #4 PCIe x1 or #1 PCIe x4, TPM 2.0, GenPurp SPI, Ind. Temp.
HALLEY (SM-C93) w/Intel® Pentium® J6426 (SKU2, QC up to 3.00 GHz, TDP 10W), 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS,HDMI, DP++, TPM 2.0, GenPurp SPI, Comm.Temp.
SMARC 2.1 Elkhart Lake Atom SKU5 x6211E (1.5M Cache, up to 3.00 GHz), DC - TDP 6.0W, 4GB RAM, 32GB eMMC, 4x PCIe, LVDS + HDMI +DP++, TPM 2.0, GP SPI, Ind Temp
HALLEY (SM-C93) w/Intel® Pentium® J6426 (SKU2, QC up to 3.00 GHz, TDP 10W), 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS,HDMI, DP++, TPM 2.0, GenPurp SPI, Comm.Temp.
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