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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 Prozessor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 Prozessor

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Cpu Type
  1. Intel® Celeron® 1 item
  2. Intel® Core™ 3 items
  3. Intel® Xeon® 1 item
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
Form Factor Specification
  1. COM Express Basic 2 items
  2. COM-HPC Client 1 item
Memory
  1. memory ≥32 2 items
Mass Storage
  1. M.2 SATA SSD slot 2 items
  2. SATA channels ≥ 2 1 item
  3. SATA channels ≥ 2 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +60°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 2 items
USB
  1. USB 2.0 ≥ 1 7 items
  2. USB 2.0 ≥ 2 7 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 9 items
  5. USB 2.0 ≥ 5 5 items
  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.1 ≥ 1 4 items
  10. USB 3.2 ≥ 1 4 items
  11. USB 3.2 ≥ 2 5 items
  12. USB 4.0 ≥ 1 1 item
  13. USB 4.0 ≥ 2 3 items
  14. USB 4.0 ≥ 4 1 item
  15. USB OTG 4 items
Video Interfaces
  1. DDI 2 items
  2. DP++ 1 item
  3. DUAL CHANNEL LVDS 2 items
  4. eDP 3 items
  5. HDMI 3 items
  6. MIPI-CSI camera conn 2 items