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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS5430 processor. (E81)

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Cpu Maker
  1. Intel 2 items
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  3. NXP 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 1 item
  5. Intel® Xeon® 1 item
  6. MediaTek Genio 510 1 item
  7. MediaTek Genio 700 1 item
  8. NXP i.MX 95 1 item
Ethernet
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  1. COM-HPC® 1 item
  2. SMARC 4 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 4 items
  2. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. COM-HPC Client 1 item
Memory
  1. memory ≤1 4 items
  2. memory ≤16 1 item
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. soldered down 3 items
Mass Storage
  1. onboard eMMC 2 items
  2. onboard eMMC 2 items
  3. SATA channels ≥ 1 1 item
  4. SD interface 1 item
  5. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 4 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 5 items
  4. 0°C ÷ +50°C 4 items
  5. 0°C ÷ +60°C 5 items
  6. 20°C ÷ +70°C 3 items
  7. -20°C ÷ +70°C 2 items
Pci Express
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  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
Ttl Uarts
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  3. TTL Uarts ≥3 4 items
USB
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  4. USB 2.0 ≥ 4 9 items
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  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.1 ≥ 1 4 items
  10. USB 3.2 ≥ 1 4 items
  11. USB 3.2 ≥ 2 5 items
  12. USB 4.0 ≥ 1 1 item
  13. USB 4.0 ≥ 2 3 items
  14. USB 4.0 ≥ 4 1 item
  15. USB OTG 4 items
Video Interfaces
  1. DP 1 item
  2. DP++ 2 items
  3. DUAL CHANNEL LVDS 2 items
  4. eDP 3 items
  5. HDMI 3 items
  6. MIPI-CSI camera conn 1 item
  7. MIPI-DSI 1 item
  8. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 1 item