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SOM-COMe-BT6-ARL
COM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra
Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59)
CPU
Intel® Core™ Ultra Processors (Series 2 Family)
Grafiken
Integrated Intel® Xe LPG+ graphic controller
Konnektivität
1x NBase-T 2.5GbE; 4x USB 10Gbps; 8x Hi-
Speed USB; up to 20 PCI-e lanes Gen4.
Speicher
Two SODIMM slot supporting DDR5-5600 memory, IBECC support, up to 64GB
Produktbeschreibung
Beschreibung
|
COM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59) |
|---|---|
CPU
|
Intel® Core™ Ultra Processors Family (Codename: Arrow Lake-H) • Intel® Core™ Ultra 9 processor 285H with vPRO, 6 P-Cores @2.5 GHz (turbo 5.4 GHz) + 8 E-Cores @1.9 GHz (turbo 4.5 GHz), 24M cache - 35/45/115W power: • Intel® Core™ Ultra 7 processor 265H, 6 P-Cores @1.2 GHz (turbo 5.4 GHz) + 8 E-Cores @0.9 GHz (turbo 4.5 GHz), 24M cache - 20/28/65W power: • Intel® Core™ Ultra 5 processor 235H with vPRO, 4 P-Cores @1.3 GHz (turbo 5.0 GHz) + 8 E-Cores @1.0 GHz (turbo 4.4 GHz), 18M cache - 20/28/65W power. Intel® Core™ Ultra Processors Family (Codename: Arrow Lake- U) - 12/15/28W Power: • Intel® Core™ Ultra 7 processor 265U with vPRO, 2 P-Cores @1.8 GHz (turbo 5.3 GHz) + 8 E-Cores @1.5 GHz (turbo 4.2 GHz), 12M cache • Intel® Core™ Ultra 5 processor 235U with vPRO, 2 P-Cores @1.6 GHz (turbo 4.9 GHz) + 8 E-Cores @1. GHz (turbo 4.1GHz), 12M cache |
|
Speicher
|
Two DDR5 SO-DIMM slot supporting DDR5-6400 IBECC modules, up to 64GB (*) IBECC: In-Band Error-Correcting Code Memory |
|
Grafiken
|
Integrated Intel® Xe LPG+ graphics controller with up to 8 Xe cores (128 EU) Support up to 4 independent displays |
Videoschnittstellen
|
3x Digital Display Interfaces (DDIs), supporting DP, HDMI® 1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives) 2x MIPI CSI channels with single on-board connector (factory option) |
Videoauflösung
|
HDMI®: up to 8K60 according to HDMI® 2.1 DP 2.1: up to 8K60Hz / 5K120Hz eDP 1.4b: up to 4K120Hz HDR Max resolution 4x4K60Hz |
Massenspeicher
|
Up to 2x S-ATA Gen3.2 channels (factory alternative to onboard NVMe + 1 PEG x4) Optional NVMe SSD (PCIE-e x4 interface) soldered onboard, up to 512GB |
Networking
|
1x NBase-T Ethernet interface with Intel® I226 GbE controller, supporting 2.5GbE |
USB
|
Up to 2x USB 4 Gen2 interfaces 4x USB 10Gbps interfaces 8x Hi-Speed USB interfaces |
|
Pci
|
1x PEG x8 Gen4 (with H series processors only) 1x PEG x4 Gen4 (factory alternative to 2x SATA) 8x PCI-e lanes Gen4 (allowed groupings x4, x2, x1) |
Audio
|
HD audio interface Soundwire interface |
Serielle Schnittstellen
|
2x UARTs |
Andere Schnittstellen
|
SPI, I2C, SM Bus, thermal management, FAN management eSPI or LPC bus (factory alternatives) TPM 2.0 on-board (factory option) LID#/SLEEP#/PWRBTN#, watchdog 4 x GPI, 4 x GPO |
Stromversorgung
|
Main: +8Vdc ÷ +20Vdc Auxiliary: +5VSBY, +3VRTC |
Betriebssystem
|
Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Yocto Kirkstone |
Betriebstemperatur
|
0°C to +60°C (Commercial version) |
Größe
|
125 x 95 mm (COM Express® Basic Form factor, Type 6 Pinout) |
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