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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 Prozessor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 Prozessor

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Cpu Type
  1. Intel® Celeron® 1 item
  2. Intel® Core™ 4 items
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 4 items
Form Factor
  1. COM-HPC® 1 item
  2. Boxed Solutions 3 items
Form Factor Specification
  1. COM-HPC Client 1 item
Memory
  1. memory ≤1 9 items
  2. memory ≤16 4 items
  3. memory ≤2 10 items
  4. memory ≤4 9 items
  5. memory ≤8 9 items
  6. memory ≥32 6 items
  7. soldered down 6 items
  8. SO_DIMM 4 items
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. M.2 SATA SSD slot 2 items
  3. SATA channels ≥ 1 2 items
  4. SATA channels ≥ 2 3 items
  5. SATA channels ≥ 3 2 items
  6. SATA channels ≥ 4 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 1 item
  4. 0°C ÷ +50°C 2 items
  5. 0°C ÷ +60°C 2 items
  6. 20°C ÷ +70°C 2 items
  7. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 4 1 item
  2. USB 3.2 ≥ 1 3 items
  3. USB 3.2 ≥ 2 4 items
  4. USB 4.0 ≥ 4 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 2 items
  3. DP++ 1 item
  4. eDP 1 item
  5. HDMI 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 1 item
  3. ONBOARD WI-FI/BLE 1 item