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Titan 300 TGL-UP3
Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)
中央处理器
11th Gen Intel® Core™ processors and Intel® Celeron® SoCs
图形
Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
连接
2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
记忆
Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC
产品详情
说明
|
Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3) |
|---|---|
中央处理器说明
|
Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) |
|
最大核数
|
4 |
|
内存说明
|
2x DDR4-3200 SODIMM clots |
|
图形说明
|
Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities |
视频界面说明
|
2x Multimode DisplayPort 1.4, on dual DP++ connector |
视频分辨率说明
|
DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC |
大容量存储器说明
|
On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB |
网络说明
|
2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* *Certification upon request |
USB说明
|
2x Superspeed USB 10Gbps ports on Dual Type-A sockets |
音频说明
|
Lineout + MicIn combo TRRS Audio Jack |
串行端口
|
2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
其他接口
|
Optional 2x 12 poles terminal block connectors with the
Power ON Button |
电源
|
12VDC to 24VDC range, Mega-Fit 2p RA Connector |
操作系统
|
Microsoft® Windows 10 IoT Enterprise LTSC |
操作温度说明
|
Commercial range: 0 °C ÷ +50 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W) Industrial range: -40 °C ÷ +60 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W)
*The values indicated refer to the maximum temperature of the environment of use of the device. It is the customer’s responsibility to verify that the temperature remains within the admissible range indicated in this manual and, if necessary, adopt any passive cooling solution together with an application-dependent cooling system that can ensure that the heat sink temperature will not damage the device itself and/or the connected mechanical parts. |
尺寸
|
199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives) |
