ZH
DE 
EN - € 
ES 
FR 
IT 
JP 
USA 
Palladio 400 RPL
Modular fanless embedded PC with 13th Gen Intel® Core™ processors
Available in Industrial Temperature Range
中央处理器
13th Gen Intel® Core™ i3/i5/i7/i9 Processors
图形
Up to Intel® UHD graphics 770 (processor dependent)
连接
Intel® embedded M.2 2230 802.11ac Wi-Fi BT 5.1 card with cables ; dual-band wireless 6.3” terminal PIFA antenna; 2x 2.5 GbE LAN (2x PoE optional)
记忆
Up to 32 GB SO-DIMM DDR4 2666
产品详情
说明
|
Next-Gen industrial PC with high modularity and multiple expansion ports, enabling powerful AI applications |
|---|---|
中央处理器说明
|
13th Gen Intel® Core™ Processors (codename: Raptor Lake-P):
|
|
内存说明
|
Up to 32 GB SO-DIMM DDR4 2666 (Optional) |
|
图形说明
|
Up to Intel® UHD graphics 770 (processor dependent) |
视频界面说明
|
2x DisplayPort |
视频分辨率说明
|
Up to 4K @60 Hz |
大容量存储器说明
|
1x M.2 2280 (SATA) |
网络说明
|
Intel® embedded M.2 2230 802.11ac Wi-Fi BT 5.1 card with cables |
USB说明
|
6x USB 3.2 Gen 2 ports |
音频说明
|
1x 3.5mm audio |
串行端口
|
2x COM RS-232/422/485 ports |
其他接口
|
5-Pin terminal block power input (12~48 VDC) |
安全性
|
PTT in BIOS |
电源
|
12~48 VDC |
操作系统
|
Compatible with Linux, Windows |
操作温度说明
|
-40 to 70°C (w/ 35W CPU) |
尺寸
|
240 x 82 x 267 mm |
| SF-K840-RPL-01-00 | 部件编号说明 Intel Core i3-13100TE (Raptor Lake) 2.1-4.1 GHz 4-Core Processor, 8 Threads - 35 W TDP, TPM 2.0, 2x 2.5 GbE LAN, 2x8 GB SO-DIMM DDR4 2666, 128 GB M.2 SATA SSD, Wi-Fi Bluetooth 5.1 Card with Cables + 2xAntenna | |
| SF-K840-RPL-02-00_ | 部件编号说明 Intel Core i5-13500TE (Raptor Lake) 1.3-4.5 GHz 14-Core Processor, 20 Threads - 35 W TDP, TPM 2.0, 2x 2.5 GbE LAN, 2x8 GB SO-DIMM DDR4 2666, 128 GB M.2 SATA SSD, Wi-Fi Bluetooth 5.1 Card with Cables + 2xAntenna | |
| SF-K840-RPL-03-00 | 部件编号说明 Intel Core i7-13700TE (Raptor Lake) 1.1-4.8 GHz 16-Core Processor, 24 Threads - 65 W TDP, TPM 2.0, 2x 2.5 GbE LAN, 2x16 GB SO-DIMM DDR4 2666, 256 GB M.2 SATA SSD, Wi-Fi Bluetooth 5.1 Card with Cables + 2xAntenna |
