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无风扇嵌入式计算机

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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codeame: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

无风扇嵌入式计算机

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  1. Intel 5 items
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  1. range 10-25 W 2 items
  2. range < 10 W 2 items
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  1. Intel® Atom™ 2 items
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 2 items
  4. Intel® Pentium® 1 item
  5. NXP i.MX 93 1 item
Ethernet
  1. ETHERNET≥1 5 items
  2. ETHERNET≥2 6 items
Form Factor
  1. Boxed Solutions 5 items
  2. Single Board Computer 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 2 items
Memory
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  2. memory ≤16 2 items
  3. memory ≤2 6 items
  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. memory ≥32 2 items
  7. soldered down 3 items
  8. SO_DIMM 2 items
Mass Storage
  1. onboard SSD 1 item
  2. M.2 SATA SSD slot 4 items
  3. onboard eMMC 2 items
  4. onboard eMMC 2 items
  5. SATA channels ≥ 1 4 items
  6. SATA channels ≥ 2 2 items
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  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 1 item
  4. 0°C ÷ +50°C 11 items
  5. 0°C ÷ +60°C 6 items
  6. 20°C ÷ +70°C 3 items
  7. -20°C ÷ +70°C 2 items
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  2. PCI-e lanes ≥ 2 1 item
USB
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  2. USB 2.0 ≥ 2 4 items
  3. USB 3.0 ≥ 1 1 item
  4. USB 3.0 ≥ 2 1 item
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  7. USB OTG 1 item
Video Interfaces
  1. DP 3 items
  2. DP++ 3 items
  3. HDMI 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 2 items
  3. M.2 Socket 2 key B 3 items
  4. ONBOARD WI-FI/BLE 1 item