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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codeame: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

无风扇嵌入式计算机

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  1. Intel 6 items
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  3. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 3 items
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  1. Intel® Atom™ 2 items
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 3 items
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  5. NXP i.MX 8M 1 item
  6. NXP i.MX 93 1 item
  7. Rockchip RK3399 1 item
Ethernet
  1. ETHERNET≥1 10 items
  2. ETHERNET≥2 14 items
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  1. Boxed Solutions 9 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 4 items
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  2. memory ≤16 3 items
  3. memory ≤2 10 items
  4. memory ≤4 8 items
  5. memory ≤8 7 items
  6. memory ≥32 3 items
  7. soldered down 5 items
  8. SO_DIMM 3 items
Mass Storage
  1. onboard SSD 1 item
  2. M.2 SATA SSD slot 4 items
  3. onboard eMMC 4 items
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  5. SATA channels ≥ 1 4 items
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  3. 0°C ÷ +50°C 9 items
  4. 0°C ÷ +60°C 5 items
  5. 20°C ÷ +70°C 3 items
  6. -20°C ÷ +70°C 2 items
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USB
  1. USB 2.0 ≥ 1 6 items
  2. USB 2.0 ≥ 2 5 items
  3. USB 3.0 ≥ 1 5 items
  4. USB 3.0 ≥ 2 3 items
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Video Interfaces
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  2. DP++ 3 items
  3. HDMI 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 6 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 4 items
  4. ONBOARD WI-FI/BLE 3 items