Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

数据表

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中央处理器

11th Gen Intel® Core™ processors and Intel® Celeron® SoCs

图形

Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays

连接

2x 2.5 GbE, Optional M.2 WWAN and WLAN modules

记忆

Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC

产品详情

技术信息

说明	不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS
中央处理器说明	Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP) Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP) Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial AI Chip: 100+ TOPS inference power - Voyager SDK for effortless deployment of AI applications
内存说明	2x DDR4-3200 SODIMM slots Up to 64GB (IBECC supported only with Core™ industrial SoCs)
图形说明	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities Support for up to four independent displays at up to 4K60 HDR resolution or one display at 8K resolution
视频界面说明	2x Multimode DisplayPort 1.4, on dual DP++ connector 2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
视频分辨率说明	DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp
大容量存储器说明	On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
网络说明	2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* *Certification upon request
USB说明	2x Superspeed USB 10Gbps ports on Dual Type-A sockets 2x Superspeed USB 20Gbps on USB Type-C slots
音频说明	Lineout + MicIn combo TRRS Audio Jack
串行端口	2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
其他接口	Optional 2x 12 poles terminal block connectors with the following I/O: • 8x GPIOs • 1x I2C • 1x SPI • 1x 5V • 1x 3.3V • 1x 12V • 3x GND Power ON Button Optional TPM 1.2/2.0 module on-board
电源	12VDC to 24VDC range, Mega-Fit 2p RA Connector Coin cell battery for RTC On-Board
操作系统	Microsoft® Windows 10 IoT Enterprise LTSC 2021 Linux (Kernel ≥ 5.4 version)
操作温度说明	Commercial range: 0°C to +40°C, with 0.7m/s airflow Extended range: -30°C to +40°C, with 0.7m/s airflow **Up to 60°C with scaled down CPU TDP
尺寸	199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)