SOM-COMe-BT6-MTL

COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)

数据表

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中央处理器

Intel® Core™ Ultra Processors Family

图形

Integrated Intel® Xe LPG graphic controller with up to 128 EU

连接

1x NBase-T 2.5GbE; 4x USB 10Gbps; 8x Hi-Speed USB; up to 20 PCI-e lanes Gen4

记忆

Two SO-DIMM slot supporting DDR5-5600 IBECC memory, up to 64GB

产品详情

技术信息

说明	COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
中央处理器说明	Intel® Core™ Ultra Processors Family (Codename: Meteor Lake-H) - 20/28/65W base power: Intel® Core™ Ultra 7 processor 165H with vPRO, 6 P-Cores with HT @1.4 GHz (turbo 5.0 GHz) + 8 E-Cores @0.9 GHz (turbo 3.8 GHz), 24M cache Intel® Core™ Ultra 7 processor 155H, 6 P-Cores with HT @1.4 GHz (turbo 4.8 GHz) + 8 E-Cores @0.9 GHz (turbo 3.8 GHz), 24M cache Intel® Core™ Ultra 5 processor 135H with vPRO, 4 P-Cores with HT @1.7 GHz (turbo 4.6 GHz) + 8 E-Cores @1.2 GHz (turbo 3.6 GHz), 18M cache Intel® Core™ Ultra 5 processor 125H, 4 P-Cores with HT @1.2 GHz (turbo 4.5 GHz) + 8 E-Cores @0.7 GHz (turbo 3.6 GHz), 18M cache Intel® Core™ Ultra Processors Family (Codename: Meteor Lake- U) - 12/15/28W Base Power: Intel® Core™ Ultra 7 processor 165U with vPRO, 2 P-Cores with HT @1.7 GHz (turbo 4.9 GHz) + 8 E-Cores @1.2 GHz (turbo 3.8 GHz), 12M cache Intel® Core™ Ultra 7 processor 155U, 2 P-Cores with HT @1.7 GHz (turbo 4.8 GHz) + 8 E-Cores @1.2 GHz (turbo 3.8 GHz), 12M cache Intel® Core™ Ultra 5 processor 135U with vPRO, 2 P-Cores with HT @1.6 GHz (turbo 4.4 GHz) + 8 E-Cores @1.1 GHz (turbo 3.6 GHz), 12M cache Intel® Core™ Ultra 5 processor 125U, 2 P-Cores with HT @1.3 GHz (turbo 4.3 GHz) + 8 E-Cores @0.8 GHz (turbo 3.6 GHz), 12M cache
内存说明	Two DDR5 SO-DIMM slot supporting DDR5-5600 IBECC modules, up to 64GB (*) IBECC: In-Band Error-Correcting Code Memory
图形说明	Integrated Intel® Xe LPG graphics controller with up to 8 Xe cores (128 EU) Support up to 4 independent displays
视频界面说明	3x Digital Display Interfaces (DDIs), supporting DP, HDMI® 1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives) 2x MIPI CSI channels with single on-board connector (factory option)
视频分辨率说明	HDMI®: up to 8K60 according to HDMI® 2.1 DP 2.1: up to 8K60Hz / 5K120Hz eDP 1.4b: up to 4K120Hz HDR Max resolution 4x4K60Hz
大容量存储器说明	Up to 2x S-ATA Gen3.2 channels (factory alternative to on-board NVMe + 1 PEG x4) Optional NVMe SSD (PCIE-e x4 interface) soldered on-board, up to 512GB
网络说明	1x NBase-T Ethernet interface with Intel® I226 GbE controller, supporting 2.5GbE and TSN
USB说明	Up to 4x USB 10Gbps interfaces Up to 8x Hi-Speed USB interfaces
Pci Description	1x PEG x8 Gen4 (with H series processors only) 1x PEG x4 Gen4 (factory alternative to 2x SATA) 8x PCI-e lanes Gen4 (allowed groupings x4, x2, x1)
音频说明	HD Audio Soundwire Audio interfaces
串行端口	2x UARTs
其他接口	SPI, I2C, SM Bus, thermal management, FAN management eSPI or LPC bus (factory alternatives) TPM 2.0 on-board (factory option) LID#/SLEEP#/PWRBTN#, watchdog 4 x GPI, 4 x GPO
电源	Main: +8Vdc ÷ +20Vdc Auxiliary: +5V_SBY, +3V_RTC
操作系统	Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Yocto Kirkstone
操作温度说明	0°C ÷ +60°C (Commercial version) * *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
尺寸	125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)