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SOM-COMe-CT6-ASL
亮点
Graphics集成的Intel® Gen12 UHD图形控制器，最多支持32个执行单元
Memory一个SO-DIMM插槽，支持DDR5-4800 IBECC内存，最大容量为16GB
发现我们的工具包
开始您的评估
通过一套完整、即用型的配置开始评估 SOM-COMe-CT6-ASL，该配置专为早期测试和开发而设计。我们限量提供的评估专用套件包含预定义的硬件配置，帮助您验证性能并探索模块的各项功能。该套件包括载板、内存、电源及线缆、存储介质以及散热解决方案。
申请您的套件
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
发现与该产品兼容的应用程序，可在SECO应用程序中心获得：即用型解决方案，可加快智能功能的开发和部署。
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
描述
|
采用Intel Atom® x7000E系列处理器（代号：Amston Lake和Alder Lake N）的COM Express® 3.1 Type 6紧凑型模块 |
|---|---|
CPU Description
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Intel® Atom® Processors x7000RE (Codename: Amston Lake) Series:
Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded E Series:
Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) PC Client Processors
(*) TCC: Time Coordinated Computing |
Memory Description
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One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB
|
Graphics Description
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Integrated Intel® Gen12 UHD graphics controller with up to 32 EU |
Video Interfaces Description
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2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C |
Video Resolution Description
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HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b |
|
Mass Storage Description
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Up to 2x S-ATA Gen3 channels |
Networking Description
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1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN |
USB Description
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Up to 2x USB 10Gbps |
PCI Description
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Up to 6x PCI-e Gen3 lanes |
Audio Description
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HD Audio interface |
Serial Ports
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2x UARTs |
Other Interfaces
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SPI, 2x I2C, SM Bus, Thermal Management, FAN management |
|
Power Supply
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+12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
Operating System
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Microsoft® Windows 10 IoT Enterprise 2019 LTSC |
Operating Temperature Description
|
0°C ÷ +60°C (Commercial version)
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensions
|
95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout) |
零件编号
COM Express 3.1 Amston Lake Intel® Atom x7835RE, 2x PCIe x2 + SATA0/1, eMMC 128GB, LVDS, USB HUB, TPM SLB 9670 Q2.0, LPC - Ind. Temp
COM Express 3.1 Amston Lake Intel® Atom x7433RE, 2x PCIe x2 + SATA0/1, eMMC 64GB, LVDS, USB HUB, TPM 2.0, eSPI - Ind. Temp
COM Express 3.1 Amston Lake Intel® Atom x7213RE, 2x PCIe x2 + SATA0/1, eDP, USB HUB, TPM 2.0, LPC - Ind. Temp
COM Express 3.1 Amston Lake Intel® Atom x7211RE, 2x PCIe x2 + SATA0/1, eDP, no USB HUB, eSPI - Comm. Temp
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