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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm® IQ8 Applications Processors

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SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor

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Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Cpu Type
    NXP i.MX8
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Opzioni
Cpu Power Consumption
  1. range < 10 W 2 elementi
Cpu Type
  1. AMD® Ryzen™ embedded 1 elemento
  2. MediaTek Genio 510 1 elemento
  3. MediaTek Genio 700 1 elemento
  4. NXP i.MX 8M 5 elementi
  5. NXP i.MX 8M Mini 6 elementi
  6. NXP i.MX 8M Nano 3 elementi
  7. NXP i.MX 8M Plus 2 elementi
  8. NXP i.MX 8X 2 elementi
  9. NXP i.MX 93 1 elemento
  10. NXP i.MX 933/935 1 elemento
  11. NXP i.MX 95 2 elementi
  12. NXP i.MX6 10 elementi
  13. NXP i.MX8 3 elementi
  14. Qualcomm® QCS5430 1 elemento
  15. Qualcomm® QCS6490 1 elemento
  16. Rockchip RK3399 2 elementi
  17. Rockchip RK3568 1 elemento
  18. Zynq® Ultras 1 elemento
  19. Qualcomm Dragonwing IQ-X 1 elemento
  20. MediaTek Genio360 1 elemento
  21. Qualcomm® Dragonwing IQ-8 1 elemento
Ethernet
  1. ETHERNET≥1 3 elementi
  2. ETHERNET≥2 1 elemento
Form Factor
  1. Qseven 1 elemento
  2. Modular HMIs 1 elemento
  3. Single Board Computer 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 elemento
  2. ≤ 80 x 80mm 1 elemento
  3. ≥ 100 x 100mm 2 elementi
Form Factor Specification
  1. 3,5" 1 elemento
  2. Other SBCs 1 elemento
  3. Qseven 70x70 mm 1 elemento
InstallationDepth
  1. 35-40 1 elemento
  2. memory ≤4 1 elemento
  3. memory ≤1 1 elemento
  4. memory ≤2 1 elemento
  5. soldered down 1 elemento
Memory
  1. memory ≤1 3 elementi
  2. memory ≤2 2 elementi
  3. memory ≤4 2 elementi
  4. memory ≤8 1 elemento
  5. soldered down 2 elementi
Mass Storage
  1. microSD card slot 1 elemento
  2. onboard eMMC 2 elementi
  3. onboard eMMC 1 elemento
  4. SATA channels ≥ 1 1 elemento
  5. SD interface 1 elemento
  6. SD interface 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 2 elementi
  2. -40°C ÷ +85°C 2 elementi
  3. 0°C ÷ +50°C 3 elementi
  4. 0°C ÷ +60°C 3 elementi
  5. 20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
ScreenDimension
  1. 1 elemento
  2. TTL Uarts ≥1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 2 elementi
  2. TTL Uarts ≥2 1 elemento
  3. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 3 elementi
  2. USB 2.0 ≥ 2 3 elementi
  3. USB 2.0 ≥ 3 3 elementi
  4. USB 2.0 ≥ 4 2 elementi
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 3.0 ≥ 1 2 elementi
  7. USB OTG 3 elementi
Video Interfaces
  1. DP 1 elemento
  2. DUAL CHANNEL LVDS 2 elementi
  3. eDP 1 elemento
  4. HDMI 2 elementi
  5. MIPI-CSI camera conn 1 elemento
  6. SINGLE CHANNEL LVDS 2 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 elemento
  2. M.2 SOCKET 2 KEY 1 elemento
  3. ONBOARD WI-FI/BLE 1 elemento
  4. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento